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ASTM F72-24

(Specification)

Standard Specification for Gold Wire for Semiconductor Lead Bonding

Standard Specification for Gold Wire for Semiconductor Lead Bonding

ABSTRACT
This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.
SCOPE
1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.  
Note 1: Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted.  
1.2 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.  
1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification.  This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

General Information

Status
Published
Publication Date
31-Mar-2024
Technical Committee
B02 - Nonferrous Metals and Alloys
Drafting Committee
B02.05 - Precious Metals and Electrical Contact Materials and Test Methods
Current Stage
Ref Project

Relations

Replaces
ASTM F72-21 - Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
Effective Date
01-Apr-2024

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ASTM F72-24 - Standard Specification for Gold Wire for Semiconductor Lead Bonding
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This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: F72 − 24
Standard Specification for
1
Gold Wire for Semiconductor Lead Bonding
This standard is issued under the fixed designation F72; the number immediately following the designation indicates the year of original
adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript
epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope F16 Test Methods for Measuring Diameter or Thickness of
Wire and Ribbon for Electronic Devices and Lamps
1.1 This specification covers round drawn/extruded gold
3
(Withdrawn 2023)
wire for internal semiconductor device electrical connections.
F205 Test Method for Measuring Diameter of Fine Wire by
Four classifications of wire are distinguished, (1) copper-
3
Weighing (Withdrawn 2023)
modified wire, (2) beryllium-modified wire, (3) high-strength
F219 Test Methods of Testing Fine Round and Flat Wire for
wire, and (4) special purpose wire.
3
Electron Devices and Lamps (Withdrawn 2023)
NOTE 1—Trace metallic elements have a significant effect upon the
F584 Practice for Visual Inspection of Semiconductor Lead-
mechanical properties and thermal stability of high-purity gold wire. It is
3
Bonding Wire (Withdrawn 2015)
customary in manufacturing to add controlled amounts of selected
impurities to gold to modify or stabilize bonding wire properties, or both.
This practice is known variously as “modifying,” “stabilizing,” or
3. Ordering Information
“doping.” The first two wire classifications denoted in this specification
refer to wire made with either of two particular modifiers, copper or
3.1 Orders for material under this specification shall include
beryllium, in general use. In the third and fourth wire classifications,
the following information:
“high-strength” and “special purpose” wire, the identity of modifying
additives is not restricted. 3.1.1 Classification: copper-modified, beryllium-modified,
high strength, or special purpose,
1.2 The values stated in SI units are to be regarded as
standard. The values given in parentheses after SI units are 3.1.2 Quantity,
provided for information only and are not considered standard.
3.1.3 Purity (Section 4),
1.3 The following hazard caveat pertains only to the test
3.1.4 Type, hard, stress relieved, or annealed (Section 5),
method portion, Section 9, of this specification. This standard
3.1.5 Breaking load and percentage elongation range (Sec-
does not purport to address all of the safety concerns, if any,
tion 5),
associated with its use. It is the responsibility of the user of this
3.1.6 Wire diameter (Section 6),
standard to establish appropriate safety, health, and environ-
3.1.7 Spool type, length of wire per spool, and type of wind
mental practices and determine the applicability of regulatory
(Section 11),
limitations prior to use.
1.4 This international standard was developed in accor-
3.1.8 Despooling, left-handed unwind or right-handed un-
dance with internationally recognized principles on standard-
wind (Section 11), and,
ization established in the Decision on Principles for the
3.1.9 Packaging and marking (Section 12).
Development of International Standards, Guides and Recom-
mendations issued by the World Trade Organization Technical
4. Chemical Composition
Barriers to Trade (TBT) Committee.
4.1 Beryllium-modified material shall conform to the
2. Referenced Documents
chemical requirements specified in Table 1.
2
2.1 ASTM Standards:
4.2 High-strength material shall conform to the chemical
requirements specified in Table 2.
1
This specification is under the jurisdiction of ASTM Committee B02 on
Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee
4.3 Special purpose material shall be in accordance with
B02.05 on Precious Metals and Electrical Contact Materials and Test Methods.
Table 3.
Current edition approved April 1, 2024. Published April 2024. Originally
approved in 1966. Last previous edition approved in 2021 as F72 – 21 which was
withdrawn January 2024 and reinstated in April 2024. DOI: 10.1520/F0072-24.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
3
Standards volume information, refer to the standard’s Document Summary page on The last approved version of this historical standard is referenced on
the ASTM website. www.astm.org.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F72 − 24
TABLE 1 Chemical Requirements, Beryllium-Modified Gold TABLE 5 Breaking
...

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Note 1: There is no known ISO equivalent to this standard.  
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Section    
Introduction and Background  
Scope and Objective  
1  
Referenced Documents  
2  
ASTM Standards  
2.1  
ACI Standard  
2.2  
NFPA Standard  
2.3  
ASME Standards  
2.4    
Terminology  
3  
ASTM Standard General Definitions  
3.1  
Applicable Definitions  
3.2  
Descriptions of Terms Specific to This ...

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