IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibi...view more

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    • Standard
      46 pages
      English language
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      1 day

his document is applicable to both self-healing capacitor units and self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage above 1 000 V and fundamental frequencies of 15 Hz to 60 Hz. The following capacitors are excluded from this document: - shunt power capacitors of the self-healing type for AC systems having a rated voltage up to and including 1 000 V (IEC 60831-1, -2); - shunt power capacitors of the non-self-he...view more

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    • Standard
      59 pages
      English language
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IEC 62430:2019 describes principles, specifies requirements and provides guidance for organizations intending to integrate environmental aspects into the design and development in order to minimize the adverse environmental impacts of their products. This document applies to processes on how ECD (environmentally conscious design) are integrated into the design and development. This document applies to any organization, regardless of its size, type or sector. This document does not provide requir...view more

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    • Standard
      32 pages
      English language
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This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that...view more

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    • Standard
      32 pages
      English language
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IEC 63171:2021 covers shielded and unshielded free and fixed connectors, circular or rectangular, for balanced single-pair data transmission, with current-carrying capacity. It specifies the IEC 63171 series' common mechanical, electrical and transmission characteristics and environmental requirements, as well as required test specifications. This document does not describe a specific mating interface. Detail specifications of mating interfaces complying with this document can be found in the fa...view more

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    • Standard
      40 pages
      English language
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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components....view more

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    • Standard
      23 pages
      English language
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IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

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    • Standard
      23 pages
      English language
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IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for t...view more

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    • Standard
      55 pages
      English language
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Amendment of EN 60825-1 in relation to European regulation (LVD2)

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    • Amendment
      17 pages
      English language
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IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

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    • Standard
      25 pages
      English language
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IEC TR 62977-1-31:2021(E) provides practical information on light measuring devices (luminance meters, colorimeters, and spectroradiometers) with luminance measuring optics for the characterization of electronic displays.

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    • Technical report
      69 pages
      English language

IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems
100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX according to ISO/IEC/IEEE 8802-3;
1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers
the emission of RF d...
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    • Standard
      108 pages
      English language

IEC 61076-3-122:2021 covers 8-way, shielded, free and fixed rectangular connectors for I/O and data transmission with frequencies up to 500 MHz. It is intended to specify the common dimensions, mechanical, electrical and environmental characteristics and tests for this family of connectors.
Connectors complying with this document provide an ingress protection level of IP20; however, they are particularly suited for industrial environments with a high level of vibration.
There are two classes o...
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    • Standard
      65 pages
      English and French language

This part of IEC 61189 specifies the reflow soldering ability test method for components
mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid
printed boards, and the reflow soldering ability test method for the lands of organic rigid printed
boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or
lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass...
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    • Standard
      44 pages
      English language
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IEC 60384-2:2021(E) applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment.
These capacitors have a possibility of "self-healing properties" depending on conditions of use. They are primarily intended for applications where the AC component is small with respect to the rated voltage. Two performance grades of capacitors are covered: grade 1 for long-life application and grade 2 for general application....
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    • Standard
      32 pages
      English language

IEC 61587-6:2021 specifies security aspects and security performance levels of the mechanical construction of indoor cabinets in accordance with IEC 60917 (all parts) and IEC 60297 (all parts). This document does not address vandalism.
This second edition cancels and replaces the first edition published in 2017. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Revised and expanded terms an...
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    • Standard
      37 pages
      English and French language

IEC 62899-402-3:2021(E) specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns which are part of the electronic products in the field of printed electronics. The measurable voids using this document are limited to those that are distinguishable by the optical image measurement.
NOTE In this document, void means an imperfection of pattern observed from a two-dimensional (2D) top-view.

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    • Standard
      18 pages
      English language

IEC 63229:2021(E) gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron microscope images for these defects. This document covers only defects in as-grown GaN epitaxial film on SiC substrate and does not include defects caused by subsequent processes.

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    • Standard
      21 pages
      English language

IEC TR 61191-8:2021(E) gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered....view more

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    • Technical report
      34 pages
      English language

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping f...
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    • Standard
      64 pages
      English and French language

IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibi...view more

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    • Standard
      88 pages
      English and French language

IEC 60825-2:2021 provides requirements and specific guidance for the safe operation and maintenance of optical fibre communication systems (OFCSs). In these systems, optical power is possibly accessible outside the confines of the transmitting equipment and/or at great distance from the optical source.
This document requires the assessment of hazard level at each accessible location of the OFCS as a replacement for product classification according to IEC 60825-1. It applies to the installed OFC...
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    • Standard
      117 pages
      English and French language

IEC 63210:2021 is applicable to both self-healing capacitor units and self-healing capacitor banks intended to be used, particularly, for power-factor correction of AC power systems having a rated voltage above 1 000 V and fundamental frequencies of 15 Hz to 60 Hz.
The following capacitors are excluded from this document:
- shunt power capacitors of the self-healing type for AC systems having a rated voltage up to and including 1 000 V (IEC 60831-1, -2);
- shunt power capacitors of the non-se...
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    • Standard
      115 pages
      English and French language

IEC 63171:2021 covers shielded and unshielded free and fixed connectors, circular or rectangular, for balanced single-pair data transmission, with current-carrying capacity.
It specifies the IEC 63171 series' common mechanical, electrical and transmission characteristics and environmental requirements, as well as required test specifications.
This document does not describe a specific mating interface. Detail specifications of mating interfaces complying with this document can be found in the ...
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    • Standard
      70 pages
      English and French language

IEC TR 62977-5-2:2021, which is a Technical Report, describes the visual assessment method of the viewing direction characteristics of display devices. This document reviews the visual assessment of viewing direction by using special test patterns to estimate colour changes, image structure, and image luminance.
Experimental results are shown to reveal the effectiveness of this kind of visual assessment.
This method is a valuable tool for identifying image quality issues, but physical measurem...
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    • Technical report
      35 pages
      English language

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any...view more

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    • Standard
      12 pages
      English language

IEC 60747-14-11:2021(E) defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wave-based semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement methods are for DC characteristics and RF characteristics, and the measurement method for RF characteristics includes a direct mode and differential amplifier mode based on feedback oscillation. This docume...view more

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    • Standard
      21 pages
      English language

IEC 62830-7:2021 defines terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of linear sliding mode triboelectric energy harvesting devices for practical use. This document is applicable to energy harvesting devices for consumer, general industries, military and aerospace applications without any limitations on device technology and size.

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    • Standard
      62 pages
      English and French language

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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    • Standard
      63 pages
      English and French language

IEC 60352-7:2020 is available as IEC 60352-7:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60352-7:2020 is applicable to spring clamp connections made with stripped wire without further preparation:
- solid conductors of 0,32 mm to 3,7 mm nominal diameter (0,08 mm2 to 10 mm2 cross‑section), or
- stranded c...
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    • Standard
      34 pages
      English language
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IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with...
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    • Standard
      403 pages
      English and French language

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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    • Standard
      49 pages
      English and French language

IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

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    • Standard
      45 pages
      English and French language

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass lamin...
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    • Standard
      80 pages
      English and French language

IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need...
view more

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    • Standard
      57 pages
      English and French language

IEC 62906-5-3:2021(E) specifies the standard measurement conditions and measuring methods for determining the parameters of image quality for full-frame laser projection displays integrating the projection devices and screens. The front and rear projection screens are included in this document. Other display devices, such as raster-scanned (flying spot) projection devices, are not included.

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    • Standard
      18 pages
      English language

IEC 62435-7:2020 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage refers to a duration that may be more than 12 months for products scheduled for storage. Philosophy, good working practice, and general means to facilitate the successful long-term storage of electronic components are also addressed.

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    • Standard
      22 pages
      English language
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IEC TS 61994-3:2021(E) gives the terms and definitions for piezoelectric, dielectric and electrostatic oscillators representing the state of the art, which are intended for use in the standards and documents of IEC TC 49.
The main changes with respect to the previous edition are as listed below:
- some definitions have been updated;
- the terminology given in IEC 60679-1:2017 has been taken into account;
- new terminologies are added.

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    • Technical specification
      19 pages
      English language

IEC TS 62966-3:2021 defines the requirements for operational and personal safety of aisle containments for IT cabinets.
The aim is to provide physical security for the IT equipment installed in the containment using the criteria “availability” and “safety”.
The requirements apply to all operational, working and maintenance procedures.
This document does not apply to ordinary persons, when using installations and equipment.
The requirements described herein are also intended to ensure that it...
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    • Technical specification
      20 pages
      English language

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

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    • Standard
      37 pages
      English and French language

This part of IEC 60384 specifies preferred ratings and characteristics, selects from
IEC 60384-1:2016 the appropriate quality assessment procedures, tests and measuring
methods, and gives general performance requirements for this type of capacitor. Test
severities and requirements specified in detail specifications referring to this sectional
specification are of an equal or higher performance level. Lower performance levels are not
permitted.
This part of IEC 60384 applies to fixed direct...
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    • Standard
      36 pages
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IEC 62830-5:2021 specifies the test method for measuring generated electric power from flexible thermoelectric devices under bending conditions. This document provides terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance of flexible thermoelectric devices. This document also describes the test conditions such as temperature, temperature difference, contact conditions, insulation and bending radius of flexible thermoelectric devi...view more

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    • Standard
      32 pages
      English and French language