IEC TR 61191-8:2021(E) gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered....view more

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      34 pages
      English language

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping f...
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      64 pages
      English and French language

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any...view more

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      12 pages
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IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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      63 pages
      English and French language

IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology.
This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
1) exclusion of 32 general terms better served by other TCs;
2) exclusion of 47 terms no longer used by the electronic assembly industry;
3) inclusion of 14 new terms related with...
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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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      49 pages
      English and French language

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass lamin...
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IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.

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      45 pages
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IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

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      37 pages
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IEC TR 61188-8:2021(E) describes the configuration of part shape data of semiconductor devices and electrical components registered in the CAD library. This document mainly describes the configuration of 2D and 3D parts shape data.

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      17 pages
      English language

IEC 62899-202-6:2020(E) provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.

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      15 pages
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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

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      83 pages
      English and French language

Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.

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      23 pages
      English and French language

This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.

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      29 pages
      English language
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IEC 62899-402-2:2020(E) describes the measurement methods of the edge waviness of printed patterns in printed electronics.
This document includes the measurement procedure, as well as the definition of edge waviness and related attributes such as average edge, touch edge and distribution edge of edge waviness, which are quite different from those that appear in the printing of graphic arts or from etching processes.

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      13 pages
      English language

This part of IEC 62496 defines the standard interface dimensions for a terminated waveguide
optical circuit board (OCB) assembly (referred to simply as "assembly") using single-row thirtytwo-
channel connectors for polymer waveguides connected with a symmetric PMT connector.

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      19 pages
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IEC 60947-4-3:2020(E) applies to semiconductor controllers and semiconductor contactors for non-motor load intended to be connected to circuits, the rated voltage of which does not exceed 1 000 V AC.
It covers their use:
– for operations of changing the state of AC electric circuits between the ON-state and the OFF-state;
– with or without bypass switching devices;
– as controller, for reducing the amplitude of the RMS AC voltage.
This third edition cancels and replaces the second edition p...
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IEC 62020-1:2020 applies to residual current monitors for household and similar purposes, having rated operational voltages and a rated voltage of the monitored circuit not exceeding 440 V AC and rated currents not exceeding 125 A.
This first edition cancels and replaces IEC 62020:1998 and IEC 62020:1998/AMD1:2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
– definition of Type F and Ty...
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IEC 61189-5-504:2020 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues.

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      49 pages
      English and French language

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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      115 pages
      English language

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

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This standard specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
...
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Gives requirements for flexible polyester (PETP) films coated on one side or both with polyester, acrylic or epoxide type adhesive for use in the fabrication of flexible printed wring.[
]Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress.[
]Films coated on both sides are used as bonding films in the fabricati...
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IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for ...
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      112 pages
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This standard addresses the qualification and procurement of printed circuit boards, which are necessary for all type of space projects.

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      269 pages
      English language
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This standard addresses the qualification and procurement of printed circuit boards, which are necessary for all type of space projects.

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      269 pages
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IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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      43 pages
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IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

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This part of IEC 62496-4 defines the standard interface dimensions for a terminated waveguide
optical circuit board (OCB) assembly (referred to simply as assembly) using single-row twelvechannel
polymer waveguides for a PMT connector and a waveguide OCB that can be
interconnected with a terminated MT ferrule.

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      14 pages
      English language
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      14 pages
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IEC 62899-204:2019 (E) defines the terms and specifies the standard methods for characterisation and evaluation. This document is applicable to insulator inks and printed insulating layers that are made from insulator inks used for printed electronics. The insulator inks include dielectric inks.

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      22 pages
      English language

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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      81 pages
      English and French language

This part of IEC 60947-7 specifies requirements for PCB terminal blocks primarily intended for
industrial or similar use.
Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent
methods to provide electrical and mechanical connection between copper conductors and the
printed circuit board.
This document applies to PCB terminal blocks intended to connect copper conductors, with or
without special preparation, having a cross-section between 0,08 mm2 and ...
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IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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      12 pages
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This document specifies a test method to determine the amount of water absorbed by metalclad
laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

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      10 pages
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This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The
requirements pertain to those assemblies that are entirely terminal/wire interconnecting
structures or to the terminal/wire portions of those assemblies that include other related
technologies (i.e. surface mounting, through-hole mounting, chip mounting).

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IEC 62954:2019 presents the requirements for the on-site emergency response facilities (referred to hereinafter as the “ERF”) which are to be used in case of incidents or accidents occurring on the associated Nuclear Power Plant (NPP).
The ERF consists of the Emergency Response Centre (ERC), the Technical Support Centre (TSC) and the Operational Support Centre (OSC).
It establishes requirements for the ERF features and ERF I&C equipment to:
· coordinate on-site operational efforts with respec...
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IEC 62899-202-3:2019(E) defines terms and specifies a standard method for the measurement of the sheet resistance of printed conductive films using a contactless eddy-current method.

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      16 pages
      English language

IEC 62888-6:2019 specifies the specific requirements for EMS to be used for benchmarking, daily energy consumption monitoring, technical research and development.
This document provides the requirements for monitoring consumed energy on board in daily services in an easy way and the measured data are applicable for general purposes in industry such as energy management, energy saving, etc. However, this document is not applicable for billing purposes.
The practical purposes in industrial field...
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      149 pages
      English and French language

IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

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IEC 62368-1:2018 is applicable to the safety of electrical and electronic equipment within the field of audio, video, information and communication technology, and business and office machines with a rated voltage not exceeding 600 V. This document does not include requirements for performance or functional characteristics of equipment.
This is a product safety standard that classifies energy sources, prescribes safeguards against those energy sources, and provides guidance on the application o...
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      775 pages
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IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

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      15 pages
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This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal
conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly
in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use
of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The
glass transition temperature is defined to ...
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IEC 61249-2-45:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 10...view more

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      25 pages
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This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal
conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly
in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use
of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The
glass transition temperature is defined to ...
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      25 pages
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IEC 61853-3:2018 describes the calculation of PV module energy rating values. The purpose of this document is to define a methodology to determine the PV module energy output (watt-hours), and the climatic specific energy rating (dimensionless) for a complete year at maximum power operation for the reference climatic profile(s) given in IEC 61853-4. It is applied to determine a specific module output in a standard reference climatic profile for the purposes of comparison of rated modules.

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      26 pages
      English and French language

IEC 62899-403-1:2018(E) specifies commonly-utilized basic design patterns to evaluate printing machines with pattern reproducibility from the view point of printability in the field of printed electronics. These basic patterns consist of several evaluation patterns and register marks. Printability is derived from the evaluation of the reproducibility of these printed patterns produced by the printed machine.

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      24 pages
      English language

IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

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    • Standard
      13 pages
      English and French language