EN 60749-40:2011
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte
La CEI 60749-40:2011 est destinée à évaluer et comparer la performance de chute d'un dispositif à semiconducteurs pour montage en surface dans des applications de produits électroniques portatifs dans un environnement d'essai accéléré, où une flexion excessive d'une carte à circuit imprimé provoque une défaillance du produit. Le but est de normaliser la méthodologie d'essai pour fournir une évaluation reproductible de la performance d'essai de chute des dispositifs à semiconducteurs pour montage en surface, en reproduisant les mêmes modes de défaillance que ceux observés normalement au cours d'un essai au niveau du produit. La présente norme internationale utilise une jauge de contrainte pour mesurer la contrainte et le taux de contrainte d'une carte au voisinage d'un composant.
Polprevodniški elementi - Metode za mehanske in klimatske preskuse - 40. del: Preskusna metoda s padcem z mizne višine z uporabo tenzometra
Ta del IEC 60749 je namenjen vrednotenju in primerjavi odpadanja površinsko nameščenih polprevodniških elementov za elektronske proizvode za ročne aplikacije v pospešenem preskusnem okolju, kjer čezmerno upogibanje plošče z vezjem povzroči okvaro proizvoda. Namen je standardizirati preskusno metodologijo, tako da zagotovi ponovljivo ocenjevanje delovanja pri preskusu odpadanja površinsko nameščenih polprevodniških elementov in hkrati podvoji načine okvare, ki se po navadi opazijo med preskusom na ravni proizvoda.
Ta mednarodni standard za merjenje deformacije in hitrosti deformacije plošče v bližini komponente uporablja tenziometer. Preskusna metoda iz IEC 60749-37 za merjenje trajanja uporabljenega mehanskega šoka in jakosti, ki sta sorazmerna z obremenitvijo na dano komponento, nameščeno na standardno ploščo, uporablja akcelerometer. V podrobni specifikaciji je navedeno, katera preskusna metoda naj se uporabi.
OPOMBA 1: Čeprav lahko ta preskus ovrednoti strukturo, pri kateri se kombinirajo metoda namestitve in njeni pogoji, zasnova plošče tiskanega vezja, spajkalni materiali, zmogljivost nameščanja polprevodniških elementov itd., ne vrednoti samo zmogljivosti namestitve polprevodniških elementov.
OPOMBA 2: Na rezultat tega preskusa močno vplivajo razlike med spajkalnimi pogoji, zasnovo vzorca polaganja na plošči tiskanega vezja, spajkalni material itd. Zato je treba pri izvedbi tega preskusa priznati, da preskus ne more intrinzično zagotoviti zanesljivosti spajkanega spoja polprevodniškega elementa.
OPOMBA 3: Kadar se mehanska obremenitev, do katere pride pri tem preskusu, pri dejanski uporabi ne zgodi, je izvajanje tega preskusa nepotrebno.
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Polprevodniški elementi - Metode za mehanske in klimatske preskuse - 40. del: Preskusna metoda s padcem z mizne višine z uporabo tenzometraHalbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von DehnungsmessstreifenDispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainteSemiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 60749-40:2011SIST EN 60749-40:2011en01-december-2011SIST EN 60749-40:2011SLOVENSKI
STANDARD
SIST EN 60749-40:2011
EUROPEAN STANDARD EN 60749-40 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2011
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2011 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-40:2011 E
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011)
Dispositifs à semiconducteurs -
Méthodes d'essais mécaniques et climatiques -
Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte (CEI 60749-40:2011)
Halbleiterbauelemente -
Mechanische und klimatische Prüfverfahren -
Teil 40: Prüfverfahren zum Fall einer Leiterplatte unter Verwendung von Dehnungsmessstreifen (IEC 60749-40:2011)
This European Standard was approved by CENELEC on 2011-08-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 60749-40:2011
EN 60749-40:2011 - 2 - Foreword The text of document 47/2094/FDIS, future edition 1 of IEC 60749-40, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-40 on 2011-08-17. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2012-05-17 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2014-08-17 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60749-40:2011 was approved by CENELEC as a European Standard without any modification. __________ SIST EN 60749-40:2011
- 3 - EN 60749-40:2011 Annex ZA
(normative) Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60749-37 - Semiconductor devices - Mechanical and climatic test methods -
Part 37: Board level drop test method using an accelerometer EN 60749-37 -
SIST EN 60749-40:2011
SIST EN 60749-40:2011
IEC 60749-40 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices – Mechanical and climatic test methods –
Part 40: Board level drop test method using a
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