EN 62374-1:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

Halbleiterbauelemente - Teil 1: Prüfung auf zeitabhängigen dielektrischen Durchbruch (TDDB) bei Isolationsschichten zwischen metallischen Leiterbahnen

Dispositifs à semiconducteurs - Partie 1: Essai de rupture diélectrique en fonction du temps (TDDB) pour les couches intermétalliques

La CEI 62374-1:2010 décrit une méthode d'essai, une structure d'essai et une méthode d'estimation de la durée de vie d'un essai de rupture diélectrique en fonction du temps (TDDB) pour des couches intermétalliques appliquées dans des dispositifs à semiconducteurs.

Polprevodniški elementi - 1. del: Preskus dielektrične plasti vrat s časovno odvisnim dielektričnim prebojem (TDDB) (IEC 62374-1:2010)

Ta del IEC 62374 opisuje preskusno metodo, preskusno strukturo in metodo ocenjevanja življenjske dobe preskusa dielektrične plasti vrat s časovno odvisnim dielektričnim prebojem, ki se uporablja v polprevodniških elementih.

General Information

• Status: Published
• Publication Date: 18-Nov-2010
• Withdrawal Date: 31-Oct-2013
• ICS: 31.080 - Semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 19-Nov-2010
• Completion Date: 19-Nov-2010
• Ref Project: SIST EN 62374-1:2011 - Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62374-1:2011
01-januar-2011
1DGRPHãþD
SIST EN 62374:2008
3ROSUHYRGQLãNLHOHPHQWLGHO3UHVNXVGLHOHNWULþQHSODVWLYUDWVþDVRYQR
RGYLVQLPGLHOHNWULþQLPSUHERMHP7''%,(&
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for
inter-metal layers (IEC 62374-1:2010)
Halbleiterbauelemente - Teil 1: Prüfung auf zeitabhängigen dielektrischen Durchbruch
(TDDB) bei Isolationsschichten zwischen metallischen Leiterbahnen (IEC 62374-1:2010)
Dispositifs à semiconducteurs - Partie 1: Essai de rupture diélectrique en fonction du
temps (TDDB) pour les couches intermétalliques (CEI 62374-1:2010)
Ta slovenski standard je istoveten z: EN 62374-1:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62374-1:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62374-1:2011

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SIST EN 62374-1:2011

EUROPEAN STANDARD
EN 62374-1

NORME EUROPÉENNE
November 2010
EUROPÄISCHE NORM

ICS 31.080 Supersedes EN 62374:2007


English version


Semiconductor devices -
Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal
layers
(IEC 62374-1:2010)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Partie 1: Essai de rupture diélectrique en Teil 1: Prüfung auf zeitabhängigen
fonction du temps (TDDB) pour les dielektrischen Durchbruch (TDDB) bei
couches intermétalliques Isolationsschichten zwischen metallischen
(CEI 62374-1:2010) Leiterbahnen
(IEC 62374-1:2010)




This European Standard was approved by CENELEC on 2010-11-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62374-1:2010 E

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SIST EN 62374-1:2011
EN 62374-1:2010 - 2 -
Foreword
The text of document 47/2063/FDIS, future edition 1 of IEC 62374-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62374-1 on 2010-11-01.
This European Standard supersedes EN 62374:2007.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-08-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2013-11-01
__________
Endorsement notice
The text of the International Standard IEC 62374-1:2010 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 62374-1:2011

IEC 62374-1
®
Edition 1.0 2010-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Semiconductor devices –
Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

Dispositifs à semiconducteurs –
Partie 1: Essai de rupture diélectrique en fonction du temps (TDDB) pour les
couches intermétalliques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
P
CODE PRIX
ICS 31.080 ISBN 978-2-88912-178-6
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