EN 60749-32:2003/A1:2010

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Amandma A1:2010 je dodatek k standardu SIST EN 60749-32:2004
This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. NOTE This test is identical to the test method contained in 1.2 of chapter 4 of IEC 60749 (1996), apart from the addition of this clause, the addition of titles to clauses 2 and 3 and renumbering.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 32: Entflammbarkeit von Bauelementen in Kunststoffgehäusen (Fremdentzündung)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 32: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause extérieure d'inflammation)

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 32. del: Vnetljivost elementov v plastičnih okrovih (z zunanjim plamenom) - Dopolnilo A1 (IEC 60749-32:2002/A1:2010)

Amandma A1:2010 je dodatek k standardu SIST EN 60749-32:2004.
Ta del IEC 60749 velja za polprevodniške elemente (diskretne naprave in integrirana vezja). Cilj tega preskusa je ugotoviti, ali element zagori zaradi zunanjega segrevanja. Preskus uporablja iglasti plamen, ki simulira učinek manjših plamen, ki so lahko posledica okoliščin okvare znotraj opreme, ki vsebuje element. OPOMBA: Ta preskus je enak preskusni metodi, vključeni v točki 1.2 poglavja 4 IEC 60749 (1996), razen dodatka tej klavzuli, dodatka naslovov klavzulama 2 in 3 ter ponovnega številčenja.

General Information

• Status: Published
• Publication Date: 02-Sep-2010
• Withdrawal Date: 31-Aug-2013
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 03-Sep-2010
• Completion Date: 03-Sep-2010
• Ref Project: SIST EN 60749-32:2004/A1:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002/A1:2010)

Relations

• Amends: EN 60749-32:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-32:2004/A1:2010
01-november-2010
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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of
plastic-encapsulated devices (externally induced) (IEC 60749-32:2002/A1:2010)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 32:
Entflammbarkeit von Bauelementen in Kunststoffgehäusen (Fremdentzündung) (IEC
60749-32:2002/A1:2010)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
32: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause extérieure
d'inflammation) (CEI 60749-32:2002/A1:2010)
Ta slovenski standard je istoveten z: EN 60749-32:2003/A1:2010
ICS:
13.220.40 Sposobnost vžiga in Ignitability and burning
obnašanje materialov in behaviour of materials and
proizvodov pri gorenju products
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-32:2004/A1:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-32:2004/A1:2010

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SIST EN 60749-32:2004/A1:2010

EUROPEAN STANDARD
EN 60749-32/A1

NORME EUROPÉENNE
September 2010
EUROPÄISCHE NORM

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 32: Flammability of plastic-encapsulated devices (externally induced)
(IEC 60749-32:2002/A1:2010)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques - Prüfverfahren -
Partie 32: Inflammabilité des dispositifs Teil 32: Entflammbarkeit
à encapsulation plastique (cas von Bauelementen in Kunststoffgehäusen
d'une cause extérieure d'inflammation) (Fremdentzündung)
(CEI 60749-32:2002/A1:2010) (IEC 60749-32:2002/A1:2010)




This amendment A1 modifies the European Standard EN 60749-32:2003; it was approved by CENELEC on
2010-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-32:2003/A1:2010 E

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SIST EN 60749-32:2004/A1:2010
EN 60749-32:2003/A1:2010 - 2 -
Foreword
The text of document 47/2018/CDV, future amendment 1 to IEC 60749-32:2002, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as amendment A1 to EN 60749-32:2003 on 2010-09-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the amendment has to be
implemented at national level by publication of
(dop) 2011-06-01
an identical national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-09-01
with the amendment have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of amendment 1:2010 to the International Standard IEC 60749-2:2002 was approved by
CENELEC as an amendment to the European Standard without any modification.
__________

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