EN 60749-9:2017

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions; b) additional variant – ‘adhesive tape pull test’.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 9: Beständigkeit der Kennzeichnung

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9: Permanence du marquage

L’IEC 60749-9:2017 a pour objet de vérifier que les marquages sur les dispositifs à semiconducteurs restent lisibles lorsqu’ils sont soumis au collage et au décollage d’étiquettes, ou à l’utilisation de solvants et de solutions de nettoyage habituellement destinés à éliminer les résidus de flux de soudage, lors du procédé d’assemblage des cartes à circuits imprimés. Cet essai s’applique à tous les types de boîtiers. Il convient pour les essais de qualification et/ou de contrôle de procédé. Cet essai est considéré comme non destructif. Les rejets issus d’essais électriques ou mécaniques peuvent être utilisés pour les besoins de cet essai.AnchorAnchor Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente: a) révision de l’Article 4, Equipement, découlant d’une refonte complète de l’Article 3, Termes et définitions; b) ajout d’un essai en variante, « essai à la bande adhésive ».

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 9. del: Trajnost označevanja (IEC 60749-9:2017)

Namen tega dela standarda IEC 60749 je ugotavljanje, ali označbe na polprevodniških elementih v trdnem stanju ostanejo čitljive, kadar so izpostavljene pritrjevanju in odstranjevanju nalepk ali uporabi topil in čistilnih raztopin, ki se običajno uporabljajo pri odstranjevanju talila za spajkanje s tiskanega vezja pri postopku izdelave.
Ta preskus se uporablja za vse vrste embalaže. Primeren je za uporabo pri preskušanju v povezavi s kvalifikacijo in/ali nadzorom procesov. Preskus se obravnava kot neporušitveni. Za namene tega preskusa se lahko uporabljajo električne ali mehanske zavrnitve.
OPOMBA 1: Ta postopek se ne uporablja za lasersko vžgano embalažo.
Številna razpoložljiva topila, ki se bi lahko uporabila, so nezadostno aktivna, prestroga ali pri neposrednem stiku ali vdihavanju hlapov celo človeku nevarna.
OPOMBA 2: Sestava topil, ki se uporabljajo v tem dokumentu, se obravnava kot običajna in predstavlja želeno strogost v povezavi z običajnimi prevlekami in označbami.

General Information

• Status: Published
• Publication Date: 15-Jun-2017
• Withdrawal Date: 06-Apr-2020
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 16-Jun-2017
• Completion Date: 16-Jun-2017
• Ref Project: SIST EN 60749-9:2017 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017)

Relations

• Replaces: EN 60749-9:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
• Effective Date: 10-May-2016

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-9:2017
01-september-2017
1DGRPHãþD
SIST EN 60749-9:2004
3ROSUHYRGQLãNLHOHPHQWL0HKDQVNHLQNOLPDWVNHSUHVNXVQHPHWRGHGHO
7UDMQRVWR]QDþHYDQMD,(&
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of
marking (IEC 60749-9:2017)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 9:
Beständigkeit der Kennzeichnung (IEC 60749-9:2017)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9:
Permanence du marquage (IEC 60749-9:2017)
Ta slovenski standard je istoveten z: EN 60749-9:2017
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-9:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-9:2017

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SIST EN 60749-9:2017


EUROPEAN STANDARD EN 60749-9

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2017
ICS 31.080.01 Supersedes EN 60749-9:2002
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 9: Permanence of marking
(IEC 60749-9:2017)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 9: Permanence du Prüfverfahren - Teil 9: Beständigkeit der Kennzeichnung
marquage (IEC 60749-9:2017)
(IEC 60749-9:2017)
This European Standard was approved by CENELEC on 2017-04-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 60749-9:2017 E

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SIST EN 60749-9:2017
EN 60749-9:2017
European foreword
The text of document 47/2348/FDIS, future edition 2 of IEC 60749-9, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60749-9:2017.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2018-01-07
national level by publication of an identical national
standard or by endorsement
• latest date by which the national standards conflicting with (dow) 2020-04-07
the document have to be withdrawn

This document supersedes EN 60749-9:2002.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-9:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
IEC 61340-2-3:2016 NOTE Harmonized as EN 61340-2-3:2016 (not modified).

2

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SIST EN 60749-9:2017



IEC 60749-9

®


Edition 2.0 2017-03




INTERNATIONAL



STANDARD



















Semiconductor devices – Mechanical and climatic test methods –

Part 9: Permanence of marking



























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.080.01 ISBN 978-2-8322-4004-5



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