Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

IEC 62899-202-7:2021(E) provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

General Information

Status
Published
Publication Date
02-Mar-2021
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
19-Mar-2021
Completion Date
03-Mar-2021
Ref Project

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IEC 62899-202-7
®

Edition 1.0 2021-03
INTERNATIONAL
STANDARD

colour
inside


Printed electronics –
Part 202-7: Materials – Printed film – Measurement of peel strength for printed
layer on flexible substrate by the 90° peel method
IEC 62899-202-7:2021-03(en)

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IEC 62899-202-7

®


Edition 1.0 2021-03




INTERNATIONAL



STANDARD








colour

inside










Printed electronics –

Part 202-7: Materials – Printed film – Measurement of peel strength for printed

layer on flexible substrate by the 90° peel method

























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 29.035.01; 31.180 ISBN 978-2-8322-9466-6




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® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC 62899-202-7:2021  IEC 2021
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Standard atmospheric conditions . 7
5 Test sample . 7
5.1 General . 7
5.2 Size of test sample . 7
5.3 Applicability of the method . 7
6 Testing method and test apparatus . 8
6.1 General .
...

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