IEC 61340-5-3:2010
(Main)Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
IEC 61340-5-3:2010 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, transport and storage. Test methods are referenced to evaluate packaging and packaging materials for these product and material properties. Performance limits are provided. This standard does not address protection from electromagnetic interference (EMI), radio frequency interference (RFI), electromagnetic pulsing (EMP) nor protection of volatile materials.
Electrostatique - Partie 5-3: Protection des dispositifs électroniques contre les phénomènes électrostatiques - Classification des propriétés et des exigences relatives à l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques
La CEI 61340-5-3:2010 définit les propriétés des emballages de protection contre les ESD nécessaires pour protéger les dispositifs sensibles aux décharges électrostatiques (ESDS) pendant toutes les phases de production, de transport et de stockage. Les méthodes d'essai sont référencées pour évaluer les emballages et les matériaux d'emballages concernant les propriétés de ces produits et matériaux. Des limites de performance sont données. La présente norme ne traite pas de la protection contre les interférence électromagnétiques (EMI), les interférence radioélectriques (RFI), les impulsions électromagnétiques (EMP) ou la protection des matériaux volatiles.
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IEC 61340-5-3
®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electrostatics –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
Electrostatique –
Partie 5-3: Protection des dispositifs électroniques contre les phénomènes
électrostatiques – Classification des propriétés et des exigences relatives à
l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques
IEC 61340-5-3:2010
---------------------- Page: 1 ----------------------
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IEC 61340-5-3
®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electrostatics –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
Electrostatique –
Partie 5-3: Protection des dispositifs électroniques contre les phénomènes
électrostatiques – Classification des propriétés et des exigences relatives à
l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 17.220.99; 29.020 ISBN 978-2-88910-507-6
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .6
3 Terms and definitions .6
4 Tailoring .7
5 Packaging application requirement .7
5.1 General .7
5.2 Inside an EPA .7
5.3 Outside an EPA.8
6 Classification of ESD packaging material properties .8
6.1 General .8
6.2 Material resistance properties .8
6.2.1 Resistance of conductive materials.8
6.2.2 Resistance of electrostatic field shielding materials .8
6.2.3 Resistance of dissipative materials.9
6.2.4 Resistance of insulative materials.9
6.3 Material electrostatic shielding properties.9
6.3.1 Electrostatic discharge shielding .9
6.3.2 Electrostatic field shielding .9
7 Technical requirements for ESD protective packaging .9
7.1 Packaging and material properties .9
7.2 Packaging marking .9
7.2.1 Classification symbol .9
7.2.2 Packaging classification .9
7.2.3 Traceability.9
Annex A (informative) ESD packaging material guidance .13
Annex B (informative) Device damage .17
Bibliography.18
Figure 1 – Example of packaging label.10
Figure 2 – Examples of EPA configurations .12
Figure A.1 – Application of ESD protective packaging.15
Table 1 – Test methods for electrostatic protective packaging .10
Table 2 – Test methods and requirements for electrostatic discharge shielding
packaging .11
Table A.1 – Packaging characteristics for environmental consideration.13
Table A.2 – Examples for qualification and verification of packaging.16
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61340-5-3 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROSTATICS –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61340-5-3 has been prepared by IEC technical committee 101:
Electrostatics.
The text of this standard is based on the following documents:
FDIS Report on voting
101/295/FDIS 101/302/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
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1
This standard was written based on the ESD Association Standard ANSI/ESD S541-2003 [1]
with some modification in relation to IEC 61340-5-1:2007 [2] and IEC/TR 61340-5-2:2007 [3].
A list of all parts in the IEC 61340 series, under the general title Electrostatics, can be found
on the IEC website
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
—————————
1
References in square brackets refer to the bibliography.
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61340-5-3 © IEC:2010 – 5 –
INTRODUCTION
Packaging is necessary to protect electrostatic discharge sensitive devices (ESDS) from
physical and environmental damage during manufacture, transportation and storage.
Additionally, packaging for ESDS should also prevent damage from static electricity.
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ELECTROSTATICS –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
1 Scope
This part of IEC 61340 defines the ESD protective packaging properties needed to protect
electrostatic discharge sensitive devices (ESDS) through all phases of production, transport
and storage. Test methods are referenced to evaluate packaging and packaging materials for
these product and material properties. Performance limits are provided.
This standard does not address protection from electromagnetic interference (EMI), radio
frequency interference (RFI), electromagnetic pulsing (EMP) nor protection of volatile
materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61340-2-3, Electrostatics – Part 2-3: Methods of test for determining the resistance and
resistivity of solid planar materials used to avoid electrostatic charge accumulation
IEC 61340-4-8, Electrostatics – Part 4-8: Standard test methods for specific applications –
Discharge shielding - Bags
ANSI/ESD STM 11.13, Two-point resistance measurement
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
electrostatic discharge
ESD
transfer of charge between bodies at different electrostatic potentials
3.2
electrostatic discharge sensitive device
ESDS
sensitive devices, integrated circuit or assembly that may be damaged by electrostatic fields
or electrostatic discharge
3.3
ESD protected area
EPA
area in which an ESDS can be handled with accepted risk of damage as a result of
electrostatic discharge or fields
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61340-5-3 © IEC:2010 – 7 –
3.4
unprotected area
UPA
areas outside an EPA as shown in Figure 2
3.5
intimate packaging
material which makes contact with ESDS
3.6
proximity packaging
material not making contact with ESDS which is used to enclose one or more devices
3.7
secondary packaging
material used primarily to give additional physical protection to the outside of a proximity
package
3.8
volume resistance
Ω
ratio of a d.c. voltage (V) applied between two electrodes placed on two (opposite) surfaces of
a specimen and the current (A) between the electrodes
3.9
surface resistance
Ω
ratio of a d.c. voltage (V) applied between two electrodes on a surface of a specimen and the
current (A) between the electrodes
4 Tailoring
This standard, or portions thereof, may not apply to all applications. Tailoring is accomplished
by evaluating the applicability of each requirement for the specific application. Upon
completion of the evaluation, requirements may be added, modified or deleted.
Tailoring decisions, including rationale, shall be documented.
5 Packaging application requirement
5.1 General
Transportation of ESDS requires packaging that provides protection from electrostatic
hazards. Within an EPA in which all ESD risks are well controlled, ESD protective packaging
may not be necessary.
5.2 Inside an EPA
Packaging used within an EPA shall consist of dissipative or conductive materials for intimate
contact.
Items sensitive to <100 V human body model (HBM) may need additional protection
depending on application and program plan requirements.
NOTE Dissipative materials are preferred for intimate packaging in situations where charged device model (CDM)
damage is a concern.
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5.3 Outside an EPA
Transportation of sensitive products outside of an EPA shall require packaging that provides
both:
a) dissipative or conductive materials for intimate contact;
b) a structure that provides electrostatic discharge shielding.
NOTE 1 If electrostatic field shielding materials are used to provide discharge shielding, a material that provides
a barrier to current flow should be used in combination with the electrostatic field shielding material.
NOTE 2 Dissipative materials are preferred for intimate packaging in situations where charged device model
(CDM) damage is a concern.
6 Classification of ESD packaging material properties
6.1 General
Materials and packages that are useful in preventing damage to sensitive electronic devices
exhibit certain properties. These properties include:
a) resistance properties:
– conductive;
– dissipative;
b) Shielding properties:
– electrostatic discharge;
– electrostatic field.
6.2 Material resistance properties
Most standard packaging materials are electrically insulative and insulative materials retain
charge. Making the package less insulative provides a path for the charge to dissipate from
the package to a material at a lower potential.
Specific ranges of resistance are useful for different purposes. Packaging can be classified by
these resistance ranges of its construction.
6.2.1 Resistance of conductive materials
Conductive materials may be surface conductive, volume conductive or both. A surface
4
conductive material shall have a surface resistance of <1 × 10 Ω.
4
Volume conductive materials shall have a volume resistance <1 × 10 Ω.
6.2.2 Resistance of electrostatic field shielding materials
Within the conductive materials classification, electrostatic field shielding materials shall have
3
a homogeneous layer with a surface resistance of <1 × 10 Ω or a volume resistance of
3
<1 × 10 Ω.
Other methods may also define the electrostatic field shielding classification.
NOTE These resistance values do not necessarily imply RFI/EMI/EMP shielding.
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61340-5-3 © IEC:2010 – 9 –
6.2.3 Resistance of dissipative materials
4 11
A static dissipative material shall have a surface resistance ≥1 × 10 Ω and <1 × 10 Ω, or a
4 11
volume resistance ≥1 × 10 Ω and <1 × 10 Ω.
6.2.4 Resistance of insulative materials
11
Electrostatic insulative materials have a surface resistance ≥1 × 10 Ω, or a volume
11
resistance ≥ 1 × 10 Ω.
6.3 Material electrostatic shielding properties
NOTE Electrostatic shielding materials protect packaged sensitive electronic items from the effects of
electrostatic discharges and fields that are external to the package.
6.3.1 Electrostatic discharge shielding
Electrostatic discharge shielding packaging is capable of attenuating an electrostatic
discharge. The calculated energy allowed inside a static discharge shielding bag shall be less
than 50 nJ when tested according to IEC 61340-4-8 or equivalent test method modified to
accommodate the product.
6.3.2 Electrostatic field shielding
Electrostatic field shielding packaging is capable of attenuating an electrostatic field.
NOTE Classified field-shielding materials may allow current flow through their volume.
7 Technical requirements for ESD protective packaging
7.1 Packaging and material properties
Table 1 and 2 provide test methods for determining material classifications for finished
packages and materials. When possible, testing should be performed on the finished
package.
7.2 Packaging marking
7.2.1 Classification symbol
ESD protective packaging shall be marked with the ESD classification symbol as shown in
Figure 1 or in accordance with customer contracts, purchase orders, drawings or other
documentation.
7.2.2 Packaging classification
The primary function code shall be marked below the ESD classification symbol as shown in
Figure 1:
S electrostatic discharge shielding;
F electrostatic field shielding;
C electrostatic conductive;
D electrostatic dissipative.
7.2.3 Traceability
Packaging should be marked with information that allows traceability to the packaging
manufacturer and to the manufacturer’s date/lot code information.
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The date/lot code should allow traceability to quality control information pertaining to the
manufacture of the specific lot of packaging.
IEC 455/10
* Primary function codes:
S electrostatic discharge shielding
F electrostatic field shielding
C electrostatic conductive
D electrostatic dissipative
Figure 1 – Example of packaging label
Table 1 – Test methods for electrostatic protective packaging
Material
c)
Test method Method description Limits
classification
Conductive
IEC 61340-2-3 R Surface resistance
S
a)
4
ANSI/ESD STM11.13 R Volume resistance <1 × 10 Ω
V
R Point-to-point resistance
p-p
Electrostatic
R Surface resistance
S
b)
field shielding
IEC 61340-2-3
3
R Volume resistance < 1 × 10 Ω
V
Dissipative
R Surface resistance
S
IEC 61340-2-3
4 11
R Volume resistance ≥1 × 10 to <1 × 10 Ω
V
a)
ANSI/ESD STM11.13
R Point-to-point resistance
p-p
Insulative
R Surface resistance
S
IEC 61340-2-3
11
R Volume resistance
≥1 × 10 Ω
V
a)
ANSI/ESD STM11.13
R Point-to-point resistance
p-p
a)
ANSI/ESD STM 11.13 describes the R point-to-point resistance measurement with a two point probe.
p-p
IEC 61340-2-3 describes all three test methods R , R and R .
S V p-p
b)
IEC 61340-2-3 describes test methods for the determination of the electrical resistance and resistivity of solid
4 12
materials in the range from 10 Ω to 10 Ω. When using the concentric ring probe according to IEC 61340-2-3 for
3
surface and volume resistance, the probe shall be able to measure values lower than 10 Ω. The test voltage
may also need to be lowered in this case.
c)
For product qualification of packaging materials, the environmental conditions for preconditioning and testing
shall be 23 °C ± 2 °C and 12 % ± 3 % relative humidity. The preconditioning before the measurement shall be
≥48 h.
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61340-5-3 © IEC:2010 – 11 –
Table 2 – Test methods and requirements for electrostatic discharge
shielding packaging
Packaging system
Shielding bags Other ESD shielding packaging
design
Test method IEC 61340-4-8 User defined
Requirement Energy < 50 nJ – intimate packaging shall be
dissipative or conductive
– a barrier layer or a defined air
gap attenuating ESD energy
a)
shall be included
a)
No component of the packaging system shall cause ESD risk when taken within EPA.
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ESD protected area
Workstation Room Building
Print Pick and Place Reflow Packing
EPA
Storage
Storage
Manual assembly
IEC 456/10
Figure 2 – Examples of EPA configurations
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61340-5-3 © IEC:2010 – 13 –
Annex A
(informative)
ESD packaging material guidance
A.1 Environment and device sensitivity
A.1.1 General
Environment and device sensitivity are two primary considerations for selecting ESD
packaging materials.
A.1.2 Environment
Since the threat to a sensitive item is usually undetermined when the item is outside an ESD
protected area (EPA), electrostatic sensitive devices (ESDS) should be placed in ESD
protective packaging whenever the item is in an unprotected area (UPA) – see Table A.1.
Table A.1 – Packaging characteristics for environmental consideration
EPA UPA
Item to be
packed
Intimate Proximity Intimate Proximity
Electrostatic Electrostatic As for inside EPA and Electrostatic discharge
conductive conductive or electrostatic shielding
ESDS
or dissipative dissipative discharge shielding
(see NOTE 1) (see NOTE 2)
NOTE 1 For battery operated ESDS, the selection of the material or the design of the packaging should ensure
that the battery does not become discharged.
NOTE 2 Electrostatic discharge shielding property is only needed when proximity packaging is not electrostatic
discharge shielding.
A.1.3 Device sensitivity
If the sensitivity of the ESDS is unknown and the device is being shipped outside of the EPA,
it should be packaged using an electrostatic discharge shielding structure that also provides
protection against electrostatic fields.
However, if the sensitivity of the ESDS is known and the ESD threat environment is well
understood, the protection level of the packaging may be reduced.
A.2 Equipotential bonding
While not always recognized as being a packaging consideration, equipotential bonding, or
the shunting of leads, can be an effective method to mitigate damage. By placing a
conductive shunt across device leads or card connectors, the various parts of the item share
the same electrical potential. While not necessarily at ground potential, the fact that parts of
the item share the same potential means that damaging current will not flow between them.
Shunting has limitations. Energy from direct discharge and electric fields may impact the item
in a manner that does not allow the energy to equalize through the shunt, but instead through
the device. ESD protective packaging that offers other protective properties is usually used in
conjunction with shunting devices.
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– 14 – 61340-5-3 © IEC:2010
A.3 Dissipative material for intimate contact
To avoid rapid discharge of ESDS due to contact with conductive surfaces, dissipative
materials are preferred.
A.4 Packaging from incoming material to the point of use
Figure A.1 shows a simplified layout of a generic electronic packaging application. Each area
has the recommended ESD packaging material properties noted. As discussed in A.1.3, if the
item sensitivity and
...
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