Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

IEC 62047-31:2019 (E) specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices. The four-point bending test utilizes a pure bending moment applied to a test piece of layered MEMS device, and the interfacial adhesion energy is measured from the critical bending moment for the steady state cracking in the weakest interface. This test method applies to MEMS devices with thin film layers deposited on semiconductor substrates. The total thickness of the thin film layers should be 100 times less than the thickness of a supporting substrate (typically a silicon wafer piece).

General Information

Status
Published
Publication Date
04-Apr-2019
Current Stage
PPUB - Publication issued
Start Date
26-Apr-2019
Completion Date
05-Apr-2019
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IEC 62047-31
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Edition 1.0 2019-04
INTERNATIONAL
STANDARD

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Semiconductor devices – Micro-electromechanical devices –
Part 31: Four-point bending test method for interfacial adhesion energy of
layered MEMS materials
IEC 62047-31:2019-04(en)

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IEC 62047-31

®


Edition 1.0 2019-04




INTERNATIONAL



STANDARD








colour

inside










Semiconductor devices – Micro-electromechanical devices –

Part 31: Four-point bending test method for interfacial adhesion energy of

layered MEMS materials


























INTERNATIONAL

ELECTROTECHNICAL


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ICS 31.080.99 ISBN 978-2-8322-6717-2



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– 2 – IEC 62047-31:2019 © IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions, symbols and designations . 5
3.1 Terms and definitions . 5
3.2 Symbols and designations . 6
4 Test piece . 6
4.1 General . 6
4.2 Shape of a test piece . 6
4.3 Measurement of dimensions . 7
4.4 Evaluation of energy release rate . 7
5 Testing method and test apparatus .
...

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