Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

IEC TS 62686-1:2020 is available as IEC TS 62686-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC TS 62686-1:2020 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition:
- update related to obsolescence of STACK Specification S/0001 revision 14 notice 3;
- addition of alternative automotive methods of compliance and revision of Annex B initially related to cross-reference to STACK Specification S/0001;
- addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.

General Information

Status
Published
Publication Date
19-Apr-2020
Current Stage
PPUB - Publication issued
Completion Date
20-Apr-2020
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IEC TS 62686-1:2020 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
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IEC TS 62686-1
Edition 3.0 2020-04
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete

semiconductors
IEC TS 62686-1:2020-04(en)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC TS 62686-1
Edition 3.0 2020-04
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete

semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-8011-9

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC TS 62686-1:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 6

INTRODUCTION ..................................................................................................................... 8

1 Scope .............................................................................................................................. 9

2 Normative references ...................................................................................................... 9

3 Terms, definitions and abbreviated terms ...................................................................... 10

3.1 Terms and definitions ............................................................................................ 10

3.2 Abbreviated terms ................................................................................................. 12

4 Technical requirements ................................................................................................. 14

4.1 General ................................................................................................................. 14

4.1.1 Overview ....................................................................................................... 14

4.1.2 Automotive components ................................................................................. 15

4.2 Procedures ........................................................................................................... 15

4.2.1 General ......................................................................................................... 15

4.2.2 Product discontinuance ................................................................................. 15

4.2.3 ESD protection during manufacture ............................................................... 15

4.2.4 Specification control ...................................................................................... 16

4.2.5 Traceability including anti-counterfeit measures ............................................ 16

4.3 Product or process change notification (PCN) ....................................................... 16

4.3.1 General ......................................................................................................... 16

4.3.2 Notification .................................................................................................... 16

4.3.3 Notification details ......................................................................................... 16

4.3.4 Notifiable changes ......................................................................................... 17

4.4 Shipment controls ................................................................................................. 17

4.4.1 General ......................................................................................................... 17

4.4.2 Shipping container and date code marking .................................................... 17

4.4.3 Date code remarking ..................................................................................... 17

4.4.4 Inner container formation ............................................................................... 17

4.4.5 Date code age on delivery ............................................................................. 18

4.4.6 ESD marking ................................................................................................. 18

4.4.7 MSL ............................................................................................................... 18

4.4.8 Lead-free marking ......................................................................................... 18

4.4.9 Labels ........................................................................................................... 18

4.5 Electrical ............................................................................................................... 19

4.5.1 General ......................................................................................................... 19

4.5.2 Electrical test ................................................................................................. 19

4.5.3 Electrical parameter assessment ................................................................... 19

4.5.4 SDRAM memories ......................................................................................... 20

4.5.5 Logic families ................................................................................................ 20

4.5.6 Power MOSFETs ........................................................................................... 20

4.5.7 Silicon rectifier diodes ................................................................................... 20

4.6 Mechanical ........................................................................................................... 20

4.6.1 General ......................................................................................................... 20

4.6.2 Device marking .............................................................................................. 20

4.6.3 Small packages ............................................................................................. 20

4.6.4 Moisture sensitivity ........................................................................................ 20

4.6.5 Robustness of hermetic seals ........................................................................ 21

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IEC TS 62686-1:2020 © IEC 2020 – 3 –

4.6.6 Termination finishes ...................................................................................... 21

4.7 Audit capability ..................................................................................................... 21

4.7.1 General ......................................................................................................... 21

4.7.2 Internal quality audits .................................................................................... 21

4.7.3 Subcontract manufacturing ............................................................................ 22

4.8 Quality assurance ................................................................................................. 22

4.8.1 General ......................................................................................................... 22

4.8.2 Quality system ............................................................................................... 22

4.8.3 Sampling plans .............................................................................................. 22

4.8.4 Failure analysis support ................................................................................. 22

4.8.5 Outgoing quality ............................................................................................ 22

4.9 Qualification .......................................................................................................... 23

4.9.1 General ......................................................................................................... 23

4.9.2 Methodology .................................................................................................. 24

4.9.3 Test samples ................................................................................................. 25

4.9.4 Qualification categories ................................................................................. 26

4.9.5 Maintenance of qualification standard ............................................................ 26

4.9.6 In-process test results ................................................................................... 26

4.9.7 Product monitor results .................................................................................. 30

4.9.8 References .................................................................................................... 30

4.9.9 Qualification report ........................................................................................ 30

4.9.10 Archiving ....................................................................................................... 30

4.9.11 Qualification by similarity ............................................................................... 30

4.9.12 Similarity assessment .................................................................................... 30

4.10 Reliability .............................................................................................................. 31

4.10.1 General ......................................................................................................... 31

4.10.2 Operating reliability........................................................................................ 31

4.10.3 Failure criteria ............................................................................................... 31

4.10.4 Corrective action ........................................................................................... 32

4.10.5 Warranty ........................................................................................................ 32

4.10.6 Single event effects (SEEs) ........................................................................... 32

4.11 Product monitor .................................................................................................... 32

4.11.1 General ......................................................................................................... 32

4.11.2 Monitor programme ....................................................................................... 32

4.11.3 Problem notification ....................................................................................... 32

4.11.4 Data reporting................................................................................................ 33

4.11.5 Samples ........................................................................................................ 33

4.11.6 Corrective action ........................................................................................... 33

4.11.7 Product monitor results .................................................................................. 33

4.11.8 Accumulated test data ................................................................................... 33

4.12 Environmental health and safety (EHS) ................................................................. 34

4.12.1 General ......................................................................................................... 34

4.12.2 EHS compliance ............................................................................................ 34

4.12.3 Device handling ............................................................................................. 34

4.12.4 Device materials ............................................................................................ 34

4.13 Shipping containers .............................................................................................. 34

4.13.1 General ......................................................................................................... 34

4.13.2 ESD requirements ......................................................................................... 34

4.13.3 Magazine reuse ............................................................................................. 36

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– 4 – IEC TS 62686-1:2020 © IEC 2020

4.13.4 Tubes ............................................................................................................ 36

4.13.5 Trays ............................................................................................................. 36

4.13.6 Tape and reel ................................................................................................ 37

4.14 Compliance with internal standards ....................................................................... 37

Annex A (informative) Test code (TC) information ................................................................ 38

A.1 General ................................................................................................................. 38

A.2 TC1 – Autoclave (ATC) ......................................................................................... 38

A.3 TC2 – Bond strength, internal (BS) ....................................................................... 38

A.4 TC3 – Die shear strength (DS) .............................................................................. 38

A.5 TC4 – Electromigration (EM) ................................................................................. 38

A.6 TC5 – Electrostatic discharge (ESD) ..................................................................... 39

A.7 TC6 – Electrical test (ET) ...................................................................................... 39

A.8 TC7 – Electrical distributions (EDs) ....................................................................... 39

A.9 TC8 – Flammability (FL) ........................................................................................ 40

A.10 TC9 – Hot carrier injection (HCI) ........................................................................... 40

A.11 TC10 – Hermeticity (HE) ....................................................................................... 40

A.12 TC11 – High temperature bake (HTB) ................................................................... 40

A.13 TC12 – High temperature blocking bias (HTBB) .................................................... 41

A.14 TC13 – High temperature gate bias (HTGB) .......................................................... 41

A.15 TC14 – High temperature reverse bias (HTRB) ..................................................... 41

A.16 TC15 – High temperature operating life (HTOL) .................................................... 41

A.16.1 General ......................................................................................................... 41

A.16.2 Qualification conditions .................................................................................. 41

A.16.3 Test results assessment ................................................................................ 42

A.16.4 Temperature acceleration factor .................................................................... 42

A.16.5 Supply voltage acceleration factor ................................................................. 43

A.17 TC16 – Latch-up (LU) ........................................................................................... 43

A.18 TC17 – Lead integrity (LI) ..................................................................................... 43

A.19 TC18 – Lid torque (LT) .......................................................................................... 43

A.20 TC19 – Mechanical sequence (MS) ....................................................................... 43

A.20.1 General ......................................................................................................... 43

A.20.2 Constant acceleration .................................................................................... 44

A.20.3 Vibration (variable frequency) ........................................................................ 44

A.20.4 Mechanical shock .......................................................................................... 44

A.21 TC20 – Marking permanency (MP) ........................................................................ 44

A.22 TC21 – Non-volatile memory operating life (NVL) .................................................. 44

A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI) ....................... 45

A.24 TC23 – Package dimensions (PD) ......................................................................... 45

A.25 TC24 – Power cycling (PTC) ................................................................................. 45

A.26 TC25 – Resistance to solder heat (RSH) ............................................................... 45

A.27 TC26 – Solder preconditioning (PC) ...................................................................... 46

A.28 TC27 – Solderability (SD) ..................................................................................... 46

A.29 TC28 – Soft error rate (SER)................................................................................. 46

A.30 TC29 – Steady state operating life (SSOL) ............................................................ 47

A.31 TC30 – Temperature cycling (TPC) ....................................................................... 47

A.32 TC31 – Temperature humidity reverse bias (THRB) .............................................. 48

A.33 TC32 – Temperature humidity bias (THB or HAST) ............................................... 48

A.34 TC33 – Terminal strength (TS) .............................................................................. 48

A.35 TC34 – Thermal resistance (thermal impedance) (TR) .......................................... 48

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IEC TS 62686-1:2020 © IEC 2020 – 5 –

A.36 TC35 – Visual inspection (VI) ................................................................................ 49

A.36.1 TC35a – External visual inspection ................................................................ 49

A.36.2 TC35b – Internal visual inspection ................................................................. 49

A.37 TC36 – Water vapour content, internal (WV) ......................................................... 50

A.38 TC37 – X-ray inspection (XR) ............................................................................... 50

A.39 TC38 – Moisture sensitivity level (MSL) ................................................................ 50

A.40 TC39 – Ball shear test (BST) ................................................................................ 50

A.41 TC40 – Negative bias temperature instability (NBTI) ............................................. 50

A.42 TC41 – Accelerated tin whisker test ...................................................................... 51

Annex B (informative) Typical automotive component requirements ..................................... 52

Annex C (informative) Requirement matrix for IEC TS 62686-1 verification .......................... 54

Bibliography .......................................................................................................................... 78

Table 1 – Label requirements................................................................................................ 19

Table 2 – Internal quality audit requirements......................................................................... 21

Table 3 – Outgoing quality .................................................................................................... 23

Table 4 – Technology/family qualification and device qualification (1 of 3) ............................ 27

Table 5 – Product monitor tests ............................................................................................ 34

Table A.1 – Conditions of the DC over voltage stress method of JP001.01 or

IEC 62416 test ...................................................................................................................... 40

Table A.2 – Examples of temperature acceleration factors .................................................... 42

Table A.3 – Dip and look test references............................................................................... 46

Table A.4 – Parameter values for consideration .................................................................... 47

Table A.5 – Test conditions................................................................................................... 47

Table A.6 – Test methods ..................................................................................................... 48

Table C.1 – Requirement matrix ............................................................................................ 54

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– 6 – IEC TS 62686-1:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE
AND HIGH PERFORMANCE (ADHP) APPLICATIONS –
Part 1: General requirements for high reliability
integrated circuits and discrete semiconductors
FOREWORD

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

The main task of IEC technical committees is to prepare International Standards. In exceptional

circumstances, a technical committee may propose the publication of a Technical Specification

when

• the required support cannot be obtained for the publication of an International Standard,

despite repeated efforts, or

• the subject is still under technical development or where, for any other reason, there is the

future but no immediate possibility of an agreement on an International Standard.

Technical Specifications are subject to review within three years of publication to decide

whether they can be transformed into International Standards.

IEC TS 62686-1, which is a Technical Specification, has been prepared by IEC technical

committee 107: Process management for avionics.
---------------------- Page: 8 ----------------------
IEC TS 62686-1:2020 © IEC 2020 – 7 –

This third edition cancels and replaces the second edition, published in 2015. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) update related to obsolescence of STACK Specification S/0001 revision 14 notice 3;

b) addition of alternative automotive methods of compliance and revision of Annex B initially

related to cross-reference to STACK Specification S/0001;

c) addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.

The text of this Technical Specificationis based on the following documents:
Draft TS Report on voting
107/361A/RVDTS
107/349/DTS
107/361/RVDTS

Full information on the voting for the approval of this Technical Specification can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62686 series, published under the general title Process management

for avionics – Electronic components for aerospace, defence and high performance (ADHP)

applications, can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific publication. At this date
...

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