Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Emballage de composants pour opérations automatisées - Partie 7: Introduction d’une plaquette thermoformée en volume pour des composants miniaturisés

L’IEC TR 60286-7:2019 contient des informations sur l’introduction d’un système innovant de conditionnement par plaquette thermoformée en volume pour des composants miniaturisés, par exemple des composants de type puce d’une taille inférieure ou égale à 1005 (métrique). Elle comprend une proposition de normalisation de l’interface entre les systèmes d’emballage et de montage automatique ainsi que les exigences relatives aux propriétés de l’emballage.

General Information

Status
Published
Publication Date
13-Oct-2019
Current Stage
PPUB - Publication issued
Completion Date
14-Oct-2019
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IEC TR 60286-7
Edition 1.0 2019-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
colour
inside
Packaging of components for automatic handling –
Part 7: Introduction of a bulk blister pack for miniaturized components
Emballage de composants pour opérations automatisées –
Partie 7: Introduction d’une plaquette thermoformée en volume pour des
composants miniaturisés
IEC TR 60286-7:2019-10(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC TR 60286-7
Edition 1.0 2019-10
TECHNICAL
REPORT
RAPPORT
TECHNIQUE
colour
inside
Packaging of components for automatic handling –
Part 7: Introduction of a bulk blister pack for miniaturized components
Emballage de composants pour opérations automatisées –
Partie 7: Introduction d’une plaquette thermoformée en volume pour des
composants miniaturisés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-7413-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC TR 60286-7:2019  IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Existing bulk feeding systems and challenges ................................................................. 6

4.1 Challenges of miniaturized components .................................................................. 6

4.2 Limitations of existing bulk feeding systems ............................................................ 7

5 Bulk blister pack .............................................................................................................. 7

5.1 General conception ................................................................................................. 7

5.1.1 Packaging style ............................................................................................... 7

5.1.2 Component pockets ......................................................................................... 7

5.1.3 Sealing ............................................................................................................ 7

5.1.4 Identification and labelling ............................................................................... 7

5.2 Outline and dimensions ........................................................................................... 8

5.2.1 Outline ............................................................................................................. 8

5.2.2 Dimensions ...................................................................................................... 9

5.3 Properties ............................................................................................................. 10

5.3.1 Material ......................................................................................................... 10

5.3.2 Electrostatic properties .................................................................................. 10

6 Bulk feeding system ...................................................................................................... 10

6.1 Applicability for component types and sizes .......................................................... 10

6.2 Example of an innovative bulk feeding system ...................................................... 10

Bibliography .......................................................................................................................... 12

Figure 1 – Typical bulk blister pack (structure) ........................................................................ 8

Figure 2 – Typical bulk blister pack (mechanism) .................................................................... 8

Figure 3 – Typical bulk blister pack (overall dimensions) ......................................................... 9

Figure 4 – Typical bulk blister pack (blister strip dimensions) ................................................ 10

Figure 5 – Pick up area with components .............................................................................. 11

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IEC TR 60286-7:2019  IEC 2019 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 7: Introduction of a bulk blister pack for miniaturized components
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

The main task of IEC technical committees is to prepare International Standards. However, a

technical committee may propose the publication of a technical report when it has collected

data of a different kind from that which is normally published as an International Standard, for

example "state of the art".
IEC TR 60286-7, which is a technical report, has been prepared by IEC technical
committee 40: Capacitors and resistors for electronic equipment.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
40/2648/DTR 40/2676/RVDTR

Full information on the voting for the approval of this technical report can be found in the

report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 5 ----------------------
– 4 – IEC TR 60286-7:2019  IEC 2019

A list of all parts in the IEC 60286 series, published under the general title Packaging of

components for automatic handling, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it

contains colours which are considered to be useful for the correct understanding of its

contents. Users should therefore print this document using a colour printer.
---------------------- Page: 6 ----------------------
IEC TR 60286-7:2019  IEC 2019 – 5 –
INTRODUCTION
Purpose of this Technical Report

This Technical Report includes the practical experience made during pilot projects and a

proposal for standardization of the interface between the package and automatic assembly

systems as well as requirements to the properties of the package itself.
Patent situation

The International Electrotechnical Commission (IEC) draws attention to the fact that it is

claimed that compliance with this document may involve the use of patents concerning a

“magazine for portion-wise receiving individualized electronic components which are present

in bulk” .

IEC takes no position concerning the evidence, validity and scope of this patent right.

The holder of this patent right has assured the IEC that he/she is willing to negotiate licences

free of charge with applicants throughout the world for claims related to the items described in

this Technical Report. In this respect, the statement of the holder of this patent right is

registered with IEC. Information may be obtained from:
ASM Assembly Systems GmbH & Co.KG, Munich(DE)
Rupert-Mayer-Straße 44, 81379 München

Attention is drawn to the possibility that some of the elements of this document may be the

subject of patent rights other than those identified above. IEC shall not be held responsible for

identifying any or all such patent rights.

ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of

patents relevant to their standards. Users are encouraged to consult the data bases for the

most up to date information concerning patents.
____________
German Patent: DE102016125495, published 28.06.2018
United States Patent Application: US 2018/0184555 A1
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– 6 – IEC TR 60286-7:2019  IEC 2019
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 7: Introduction of a bulk blister pack for miniaturized components
1 Scope

This part of IEC 60286 contains information about the introduction of an innovative bulk blister

packing system for miniaturized components, for example chip type components of size 1005

(metric) and smaller. It includes a proposal for standardization of the interface between the

packaging and automatic assembly systems and requirements to the properties of the

packaging.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
packaging

product made of any material or any nature to be used for the containment, protection, and

structured alignment for automatic assembly, handling and delivery
[SOURCE: IEC 60286-3:2019, 3.1.3]
3.2
packing

operations involved in the preparation of goods for containment, protection, and structured

alignment for automatic assembly, handling, and delivery
3.3
blister pack
type of packaging in which components are packed, consisting of domes of plastic
EXAMPLE The example is shown in Figure 1.
4 Existing bulk feeding systems and challenges
4.1 Challenges of miniaturized components

Progressing miniaturization of components has caused an increasing mismatch between

packaging volume and component size, where the volume of components became just a small

percentage of the total packaging volume in the case of tape and reel packaging.
---------------------- Page: 8 ----------------------
IEC TR 60286-7:2019  IEC 2019 – 7 –

In addition, to enable a smooth pick and place process of such components, tight tolerances

of pocket sizes are needed, which are technically difficult to achieve and increase costs.

As an alternative, bulk packaging and feeding systems had been developed in the past.

4.2 Limitations of existing bulk feeding systems

Existing bulk feeding systems are based on linear feeders, which show various constraints:

• tight dimensional tolerances of components required;
• variation of component thickness is critical;
• cubical components cannot be handled;
• difficult cleaning processes;
• risk of mixed components.
5 Bulk blister pack
5.1 General conception
5.1.1 Packaging style

Blister with seven pockets, five filled with components, one empty pocket and one smaller

size pocket for orientation (Figure 1 and Figure 4).

The small pocket is for mechanical orientation and indicates the end of the strip. The first

pocket is intentionally empty to avoid accidental loss of components during handling.

NOTE The smaller size pocket can be used for provision of test samples, for example for inspection.

5.1.2 Component pockets

The dimensions and maximum filling level of pockets are designed such, that the volume is

aligned to the maximum capacity of bulk feeders.

The dimensions and maximum filling level of pockets shall be specified such, that packed

components will not be damaged during transport and handling.
5.1.3 Sealing

The complete circumference of pocket shall be sealed strongly enough to prevent accidental

loss of components during transportation and handling, but not exceed 15 N when pulled off in

a 180° direction. The seal tape shall be not sticky, so that the packed components do not

attach to the seal.
5.1.4 Identification and labelling
5.1.4.1 Information on label on top

The label on top contains the same information as in the matrix code on the bottom side, and

provides the minimum content described below:
• manufacturer identification;
• manufacturer part number;
• quantity;

NOTE The quantity information on the label is the total quantity of components contained in the blister

packaging. The filling quantity of the component pockets is the same in all five pockets.

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– 8 – IEC TR 60286-7:2019  IEC 2019
• lot code.
Additional information can be given as appropriate, also in human readable form.
Details can be found in IEC 62090.
5.1.4.2 Information on label on bottom

A label is placed on the first filled pocket with information identical to that on the bar code on

top (see 5.1.4.1), but in the form of a 2D-matrix code.
5.2 Outline and dimensions
5.2.1 Outline
The structure of a typical bulk blister pack is shown in Figure 1.
Figure 1 – Typical bulk blister pack (structure)
The mechanism of a typical bulk blister pack is shown in Figure 2.
Figure 2 – Typical bulk blister pack (mechanism)
---------------------- Page: 10 ----------------------
IEC TR 60286-7:2019  IEC 2019 – 9 –
5.2.2 Dimensions

The dimensions of a typical bulk blister pack are shown in Figure 3 and Figure 4.

NOTE It is possible that the slide lid does not cover the blister strip completely.

a) Top view b) Width side view
Key
L Length = 169 mm ± 1 mm
H Height = (13,7 ± 1) mm
W Width = 35,8 mm ± 1 mm
W Width of cover tape = 28,0 mm max. (considering seal runout)
W Width of rim of the slide lid = 2,7 mm to 5,0 mm
D Diameter of pocket = φ19 mm ± 0,2 mm
H Height of pass line = 2 mm ± 0,2 mm
H Thickness of slide lid = 4,0 mm to 6,0 mm
Figure 3 – Typical bulk blister pack (overall dimensions)
---------------------- Page: 11 ----------------------
– 10 – IEC TR 60286-7:2019  IEC 2019
Key
L Length = (168 ± 1) mm
L Length from edge of blister strip to center of D = (12,0 ± 0,5) mm
3 1
W Width = (32 ± 0,3) mm
W Outer width of convex part of pocket = 24 mm max.
W Width from edge of blister strip to center of D = (16,0 ± 0,5) mm
6 1
D Pocket size: diameter = φ19 mm ± 0,2mm, at a depth = 12,5 mm ± 0,5 mm
D Small pocket: diameter = φ15 mm ± 0,2mm, at a depth = 5,5 mm ± 0,5 mm
P Pocket pitch = 24,0 mm ± 0,1 mm
R Radius = (8 ± 0,5) mm
Figure 4 – Typical bulk blister pack (blister strip dimensions)
5.3 Properties
5.3.1 Material

The bulk blister pack is made from material providing sufficient strength and stability to

prevent damage and to enable appropriate handling for filling the components into a cartridge

or similar container for refilling the feeder.
5.3.2 Electrostatic properties

Where applicable, the blister shall comply with the requirements for material to be brought

into electrostatic protected areas (see IEC 61340-5-1), for example conductive or electrostatic

dissipative (see IEC 61340-5-3).
6 Bulk feeding system
6.1 Applicability for component types and sizes

The bulk blister pack and related feeding system are most effective for all no-lead cuboid-type

components with a length and width of less than 1 mm. The minimum size depends upon the

optical resolution of the pick and place system.

It is designed primarily for non-polarity devices. For components with a specific orientation, a

marking or other means for identification shall be identifiable on the component's bottom.

6.2 Example of an innovative bulk feeding system

An innovative bulk feeding system for cuboid components can move bulk components in a

way that allows transporting large numbers (several hundred loose components) within a

feeding unit in parallel to an area, where this bulk of components can be separated. The

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IEC TR 60286-7:2019  IEC 2019 – 11 –

separation is done in a way that components can then be picked up, one by one, by a pick

and place machine.

All this can be achieved in a feeder unit, which contains a vibration generator, which

generates controlled 3-dimensional vibrations, which move components in a so-called

cartridge to a glass plate, on which the components are separated by a second modulated

vibration sequence that spreads out the components randomly and also is able to flip them.

Underneath the glass plate, a camera takes a picture of the randomly distributed components

and, with a smart evaluation algorithm, a vision system can identify which components are in

the right position and orientation to be picked up (see Figure 5). The result of the picture

evaluation is a list with component positions being able to be picked-up (distance between

adjacent components, X and Y and angle orientation). With this information, the head can now

pick up the components. The remaining components that are on the glass plate are then

vibrated again and fall into new positions and orientations. If there are not enough

components to be picked, more components can be vibrated from the cartridge onto the glass

plate.
Figure 5 – Pick up area with components

For refilling the cartridge with new components, a refill station is used which allows to fill bulk

components, which are delivered in bulk blister packs, into the empty cartridge. The refill

station can identify each individual cartridge via an RFID and can verify via a barcode label on

the bottom of a bulk blister pack that only components with the correct part number can be

used for refilling the cartridge. Via the barcode, the refill station also gets the information

about how many components are contained in the bulk blister pack. The number of

components that were filled into the cartridge is then also stored under the ID of the cartridge

so that the filling level of a cartridge is known and announced to the user.
---------------------- Page: 13 ----------------------
– 12 – IEC TR 60286-7:2019  IEC 2019
Bibliography

IEC 60286-3:2019, Packaging of components for automatic handling – Part 3: Packaging of

surface mount components on continuous tapes

IEC 61340-5-1:2016, Electrostatics – Part 5-1: Protection of electronic devices from

electrostatic phenomena – General requirements

IEC 61340-5-3:2015, Electrostatics – Part 5-3: Protection of electronic devices from

electrostatic phenomena – Properties and requirements classification for packaging intended

for electrostatic discharge sensitive devices

IEC 62090:2017, Product package labels for electronic components using bar code and two-

dimensional symbologies
___________
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– 14 – IEC TR 60286-7:2019  IEC 2019
SOMMAIRE

AVANT-PROPOS .................................................................................................................. 15

INTRODUCTION ................................................................................................................... 17

1 Domaine d’application ................................................................................................... 18

2 Références normatives .................................................................................................. 18

3 Termes et définitions ..................................................................................................... 18

4 Systèmes existants d’alimentation en volume et enjeux ................................................. 19

4.1 Enjeux concernant les composants miniaturisés ................................................... 19

4.2 Limites des systèmes existants d’alimentation en volume ..................................... 19

5 Plaquette thermoformée en volume ............................................................................... 19

5.1 Conception générale ............................................................................................. 19

5.1.1 Modèle d’emballage ....................................................................................... 19

5.1.2 Pochettes de composants .............................................................................. 19

5.1.3 Etanchéité ..................................................................................................... 19

5.1.4 Identification et étiquetage ............................................................................. 20

5.2 Encombrement et dimensions ............................................................................... 20

5.2.1 Encombrement .............................................................................................. 20

5.2.2 Dimensions .................................................................................................... 21

5.3 Propriétés ............................................................................................................. 22

5.3.1 Matériau ........................................................................................................ 22

5.3.2 Propriétés électrostatiques ............................................................................ 22

6 Système d’alimentation en volume ................................................................................. 22

6.1 Applicabilité des types et tailles des composants .................................................. 22

6.2 Exemple de système innovant
...

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