SIST EN IEC 62435-3:2020

Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (IEC 62435-3:2020)

This part of IEC 62435 describes the aspects of data storage that are necessary for
successful use of electronic components being stored after long periods while maintaining
traceability or chain of custody. It defines what sort of data needs to be stored alongside the
components or dies and the best way to do so in order to avoid losing data during the storage
period. As defined in this document, long-term storage refers to a duration that can be more
than twelve months for products scheduled for long duration storage. Philosophy, good
working practice, and general means to facilitate the successful long-term-storage of
electronic components are also addressed.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and
packaged devices.

Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 3: Daten (IEC 62435-3:2020)

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 3: Données (IEC 62435-3:2020)

L'IEC 62435-3:2020 décrit les aspects du stockage de données nécessaires à la bonne utilisation des composants électroniques stockés après de longues périodes, tout en maintenant une traçabilité ou une continuité de possession. Elle définit les types de données à stocker avec les composants ou les puces et la meilleure façon de le faire en vue d'éviter une perte de données pendant la période de stockage. Comme défini dans le présent document, le stockage de longue durée fait référence à une durée pouvant dépasser douze mois, pour des produits destinés à être stockés pendant une longue durée. Les concepts, les bonnes pratiques et les moyens généraux de nature à faciliter la réussite d'un stockage de longue durée de composants électroniques sont aussi abordés.
NOTE: Dans l'IEC 62435 (toutes les parties), le terme "composants" fait référence aux puces, aux plaquettes et aux dispositifs passifs et encapsulés.

Elektronske komponente - Dolgoročno skladiščenje elektronskih polprevodniških elementov - 3. del: Podatki (IEC 62435-3:2020)

General Information

• Status: Published
• Publication Date: 28-Apr-2020
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 22-Apr-2020
• Due Date: 27-Jun-2020
• Completion Date: 29-Apr-2020
• Ref Project: EN IEC 62435-3:2020 - Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 62435-3:2020
01-junij-2020
Elektronske komponente - Dolgoročno skladiščenje elektronskih polprevodniških
elementov - 3. del: Podatki (IEC 62435-3:2020)
Electronic components - Long-term storage of electronic semiconductor devices - Part 3:
Data (IEC 62435-3:2020)
Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 3:
Daten (IEC 62435-3:2020)
Composants électroniques - Stockage de longue durée des dispositifs électroniques à
semiconducteurs - Partie 3: Données (IEC 62435-3:2020)
Ta slovenski standard je istoveten z: EN IEC 62435-3:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 62435-3:2020 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 62435-3:2020

---------------------- Page: 2 ----------------------
SIST EN IEC 62435-3:2020


EUROPEAN STANDARD EN IEC 62435-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
April 2020
ICS 31.020

English Version
Electronic components - Long-term storage of electronic
semiconductor devices - Part 3: Data
(IEC 62435-3:2020)
Composants électroniques - Stockage de longue durée des Elektronische Bauteile - Langzeitlagerung elektronischer
dispositifs électroniques à semiconducteurs - Partie 3: Halbleiterbauelemente - Teil 3: Daten
Données (IEC 62435-3:2020)
(IEC 62435-3:2020)
This European Standard was approved by CENELEC on 2020-03-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62435-3:2020 E

---------------------- Page: 3 ----------------------
SIST EN IEC 62435-3:2020
EN IEC 62435-3:2020 (E)
European foreword
The text of document 47/2608/FDIS, future edition 1 of IEC 62435-3, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62435-3:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-12-24
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-03-24
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62435-3:2020 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-17:1994 NOTE Harmonized as EN 60068-2-17:1994 (not modified)
IEC 60068-2-20:2008 NOTE Harmonized as EN 60068-2-20:2008 (not modified)
IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1
IEC 60749-21 NOTE Harmonized as EN 60749-21
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1
IEC 62258 (series) NOTE Harmonized as EN 62258 (series)
IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3
IEC 62402 NOTE Harmonized as EN IEC 62402
IEC 62435-2 NOTE Harmonized as EN 62435-2
ISO 14644 (series) NOTE Harmonized as EN ISO 14644 (series)

2

---------------------- Page: 4 ----------------------
SIST EN IEC 62435-3:2020



IEC 62435-3

®


Edition 1.0 2020-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Electronic components – Long-term storage of electronic semiconductor

devices –

Part 3: Data




Composants électroniques – Stockage de longue durée des dispositifs

électroniques à semiconducteurs –


Partie 3: Données













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.020 ISBN 978-2-8322-7889-5




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 5 ----------------------
SIST EN IEC 62435-3:2020
– 2 – IEC 62435-3:2020 © IEC 2020
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Data storage . 7
4.1 General . 7
4.2 Data storage options . 8
4.3 Paper data storage concerns . 8
4.4 Electronic data storage concerns . 8
4.5 Data storage media failure mode considerations . 9
4.6 Media reader and decoding . 9
4.7 Computer . 10
4.8 Software and data format . 10
5 Data elements . 10
5.1 General data element considerations . 10
5.2 Traceability data . 11
5.3 Periodic checks of data . 11
5.4 Component description data package . 11
Annex A (informative) Example checklist for project managers . 12
Bibliography . 13

Table A.1 – Example checklist for data management . 12

---------------------- Page: 6 ----------------------
SIST EN IEC 62435-3:2020
IEC 62435-3:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 3: Data

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62435-3 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2608/FDIS 47/2615/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 7 ----------------------
SIST EN IEC 62435-3:2020
– 4 – IEC 62435-3:2020 © IEC 2020
A list of all parts in the IEC 62435 series, published under the general title Electronic
components – Long-term storage of electronic semiconductor devices, can be found on the
IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

---------------------- Page: 8 ----------------------
SIST EN IEC 62435-3:2020
IEC 62435-3:2020 © IEC 2020 – 5 –
INTRODUCTION
This document applies to the long-term storage of electronic components.
This document deals with the long-term storage (LTS) of electronic devices drawing on the
best long-term storage practices currently known. For the purposes of this document, LTS is
defined as any device storage whose duration can be more than 12 months for product
scheduled for long duration storage. While intended to address the storage of unpackaged
semiconductors and packaged electronic devices, nothing in this document precludes the
storage of other items under the storage levels defined herein.
Although it has always existed to some extent, obsolescence of electronic components and
particularly of integrated circuits, has become increasingly intense over the last few years.
Indeed, with the existing technological boom, the commercial life of a component has become
very short compared with the life of industrial equipment such as that encountered in the
aeronautical field, the railway industry or the energy sector.
The many solutions enabling obsolescence to be resolved are now identified. However,
selecting one of these solutions should be preceded by a case-by-case technical and
economic feasibility study, depending on whether storage is envisaged for field service or
production, for example:
• remedial storage as soon as components are no longer marketed;
• preventive storage anticipating declaration of obsolescence.
Taking into account the expected life of some installations, sometimes covering several
decades, the qualification times, and the unavailability costs, which can also be very high, the
solution to be adopted to resolve obsolescence should often be rapidly implemented. This is
why the solution retained in most cases consists in systematically storing components which
are in the process of becoming obsolescent.
The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery
of the implemented process and especially of the storage environment, although this mastery
becomes critical when it comes to long-term storage.
All handling, protection, storage and test operations are recommended to be performed
according to the state of the art.
The application of the approach proposed in this document in no way guarantees that the
stored components are in perfect operating condition at the end of this storage. It only
comprises a means of minimizing potential and probable degradation factors.
Some electronic device users have the need to store electronic devices for long periods of
time. Lifetime buys are commonly made to support production runs of assemblies that well
exceed the production timeframe of its individual parts. This puts the user in a situation
requiring careful and adequate storage of such parts to maintain the as-received solderability
and minimize any degradation effects to the part over time. Major degradation concerns are
moisture, electrostatic fields, ultra-violet light, large variations in temperature, air-borne
contaminants, and outgassing.
Warranties and sparing also present a challenge for the user or repair agency as some
systems have been designated to be used for long periods of time, in some cases for up to
40 years or more. Some of the devices needed for repair of these systems will not be
available from the original supplier for the lifetime of the system or the spare assembly may
be built with the original production run but then require long-term storage. This document
was developed to provide a standard for storing electronic devices for long periods of time.

---------------------- Page: 9 ----------------------
SIST EN IEC 62435-3:2020
– 6 – IEC 62435-3:2020 © IEC 2020
The storage of devices that are moisture sensitive but that do not need to be stored for long
periods of time is dealt with in IEC TR 62258-3.
Long-term storage assumes that the device is going to be placed in uninterrupted storage for
a number of years. It is essential that it be useable after storage. It is important that storage
media, the local environment and the associated part data be considered together.
These guidelines do not imply any warranty of product or guarantee of operation beyond the
storage time given by the manufacturer.
The IEC 62435 series is intended to ensure that adequate reliability is achieved for devices in
user applications after long-term storage. Users are encouraged to request data from
suppliers to applicable specifications to demonstrate a successful storage life as requested by
the user. These standards are not intended to address built-in failure mechanisms that would
take place regardless of storage conditions.
These standards are intended to give practical guide to methods of long-duration storage of
electronic components where this is intentional or planned storage of product for a number of
years. Storage regimes for work-in-progress production are managed according to company
internal process requirements and are not detailed in IEC 62435 (all parts).
The overall standard is split into a number of parts. Parts 1 to 4 apply to any long-term
storage and contain general requirements and guidance, whereas Parts 5 to 9 are specific to
the type of product being stored.
Electronic components requiring different storage conditions are covered separately starting
with Part 5.
The structure of the IEC 62435 series as currently planned consists of the following:
– Part 1: General
– Part 2: Deterioration mechanisms
– Part 3: Data
– Part 4: Storage
– Part 5: Die and wafer devices
– Part 6: Packaged or finished devices
– Part 7: MEMS
– Part 8: Passive electronic devices
– Part 9: Special cases

---------------------- Page: 10 ----------------------
SIST EN IEC 62435-3:2020
IEC 62435-3:2020 © IEC 2020 – 7 –
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 3: Data



1 Scope
This part of IEC 62435 describes the aspects of data storage that are necessary for
successful us
...