IEC 62396-8:2020 is intended to provide awareness and guidance with regard to the effects of small particles (that is, protons, electrons, pions and muon fluxes) and single event effects on avionics electronics used in aircraft operating at altitudes up to 60 000 feet (18 300 m). This is an emerging topic and lacks substantive supporting data. This document is intended to help aerospace or ground level electronic equipment manufacturers and designers by providing awareness guidance for this new ...view more

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    • Technical report
      59 pages
      English language

IEC TS 62686-1:2020 is available as IEC TS 62686-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC TS 62686-1:2020 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components th...
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    • Technical specification
      83 pages
      English language

IEC 62668-1:2019 defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC 62668-2. Although developed for the avionics industry, this document can...view more

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    • Standard
      183 pages
      English and French language

IEC TR 63238-1:2019 provides information and a template to create an interface control document (ICD) for any project which includes electronic assemblies, such as electronic circuit card assemblies (CCAs) or electronic devices, connected together. This document proposes electrical signal naming conventions when interfacing electronic assemblies, and an example containing seven signal naming conventions is included. This document supports original equipment manufacturers (OEMs) in the preparatio...view more

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    • Technical report
      15 pages
      English language

IEC 62668-2:2019, defines requirements for avoiding the use of counterfeit, recycled and fraudulent components when these components are not purchased from the original component manufacturer (OCM) or are purchased from outside of franchised distributor networks for use in the aerospace, defence and high performance (ADHP) industries. This practice is used, as derogation, only when there are no reasonable or practical alternatives.
NOTE: Typically this document is used in conjunction with IEC 6...
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    • Standard
      116 pages
      English and French language

IEC TS 62686-2:2019 defines the minimum requirements for general purpose "off-the-shelf" COTS (commercial off-the-shelf) passive components for aerospace, defence and high performance (ADHP) applications. This document applies to all passive components that can be operated in ADHP applications within the manufacturers’ publicly available data sheet limits in conjunction with IEC TS 62239-1. This document can be used by other high performance and high reliability industries, at their discretion.
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    • Technical specification
      59 pages
      English language

IEC 62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (O...view more

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    • Standard
      159 pages
      English and French language

IEC TR 62240-2:2018(E) describes a process and a method for selecting digital semiconductor microcircuits by ensuring that their lifetime is compatible with the requirements of aerospace, defence and high performance (ADHP) applications (generally in connection with functional environments). Methods and guidelines are provided to assess the long term reliability of COTS semiconductor microcircuits in such applications; they mainly apply during the electronic design phase when selecting semicondu...view more

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    • Technical report
      28 pages
      English language

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining...view more

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    • Technical specification
      41 pages
      English language

IEC TR 62240-1:2018 is available as IEC TR 62240-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are availabl...
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    • Technical report
      55 pages
      English language

IEC 62396-2:2017(E) aims to provide guidance related to the testing of electronic components for purposes of measuring their susceptibility to single event effects (SEE) induced by neutrons generated by cosmic ray interactions in the Earth’s atmosphere (atmospheric neutrons). Since the testing can be performed in a number of different ways, using different kinds of radiation sources, it also shows how the test data can be used to estimate the SEE rate of electronic components and boards due to a...view more

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    • Standard
      42 pages
      English language

IEC TR 62396-7:2017 is a technical report which describes a process to account for the effects of atmospheric radiation on electronic equipment. Single event effects (SEE) due to atmospheric radiation are one class of possible failure mechanisms that are addressed in the safety and reliability analyses of electronic equipment and associated functions. This document focuses on electronic components, electronic equipment and associated electronic functions. System level analysis is not addressed i...view more

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    • Technical report
      18 pages
      English language

IEC TR 62396-6:2017 is a technical report which provides information intended to improve the understanding of extreme space weather events; it details the mechanisms and conditions that produce “extreme space weather” (ESW) as a result of a large increase in the activity on the surface of the sun and it discusses the potential radiation environment based on projection of previous recorded ESW.

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    • Technical report
      19 pages
      English language

IEC TS 62239-2:2017(E) applies to the development of COTS assembly management plans for the integration and management of electronic COTS assemblies in electronic systems used in the ADHP markets where reliability is generally critical. Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans could consider tailoring the requirements of this document. ...view more

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    • Technical specification
      64 pages
      English language

IEC TS 62564-1:2016(E) defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)". This new edition includes the following significant technical changes with respect to the previous edition:
- refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications;
- adds information regarding components' life expectancy.

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    • Technical specification
      18 pages
      English language

IEC 62396-1:2016(E) is available as IEC 62396-1:2016 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62396-1:2016(E) provides guidance on atmospheric radiation effects on avionics electronics used in aircraft operating at altitudes up to 60 000 ft (18,3 km). It defines the radiation environment, the effects of that environment on electronics and provides design considerations for the acco...
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    • Standard
      104 pages
      English language

IEC 62396-5:2014(E) provides a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset (SEU) in microelectronics. IEC 62396-5 addresses two main items:
- a detailed evaluation of the existing literature on measurements of the thermal flux inside of airliners, and
- an enhanced compilation of the thermal neutron SEU cross-section in currently available SRAM devices (more than 20 different devices). The net result of the ...
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    • Standard
      21 pages
      English language

IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair f...view more

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    • Technical specification
      42 pages
      English language

IEC/TS 62647-23:2013(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the tec...view more

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    • Technical specification
      45 pages
      English language

IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both dur...view more

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    • Technical specification
      70 pages
      English language

IEC 62396-3:2013(E) provides guidance and furthermore it provides necessary requirements for those involved in the design of avionic systems and equipment and the resultant effects of atmospheric radiation-induced single event effects (SEE) on those avionic systems. The outputs of the activities and objectives described in this part of IEC 62396 will become inputs to higher level certification activities and required evidences. It builds on the initial guidance on the system level approach to si...view more

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    • Standard
      28 pages
      English language

IEC 62396-4:2013(E) provides guidance on atmospheric radiation effects and their management on high voltage (nominally above 200 V) avionics electronics used in aircraft operating at altitudes up to 60 000 ft (18,3 km). This part of IEC 62396 defines the effects of that environment on high voltage electronics and provides design considerations for the accommodation of those effects within avionics systems. This part of IEC 62396 provides technical data and methodology for aerospace equipment man...view more

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    • Standard
      18 pages
      English language

IEC/TS 62647-21:2013(E) is designed to assist program management and/or systems engineering management in managing the transition to lead-free electronics to assure product reliability and performance. The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerospace and/or high performance program. The annexes in the document describe tools that can be used in conjunction with this document. This document is designed to as...view more

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    • Technical specification
      34 pages
      English language

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

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    • Technical specification
      68 pages
      English language

IEC/TS 62647-1:2012(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and defence electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. Keywords: avionics, lead-free solder

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    • Technical specification
      32 pages
      English language

IEC/TS 62500:2008(E) specifies the targets assigned to highly accelerated tests, their basic principles, their scope of application and their implementation procedures. Is primarily intended for programme managers, designers, test managers, and RAMS experts to facilitate the draft of the specification and execution of highly accelerated tests. Is applicable to all programmes and is of primary interest to the industrial firms in charge of designing, developing and producing equipment built for th...view more

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    • Technical specification
      38 pages
      English language