This part of IEC 61189 is a test method designed to determine the proportion of soluble ionic
residues present upon a circuit board, electronic component or assembly. The conductivity of
the solution used to dissolve the ionic residues is measured to evaluate the level of ionic
residues.

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This document defines product category rules (PCR) for electronic and electrical products and systems (EEPS).
It specifies the process and requirements on how to conduct life cycle assessment in the context of
environmental declarations.
PCR is complemented by additional product-specific rules (PSR), which further define e.g. functional units and
default scenarios in the product-specific context. Therefore, it also provides guidance on how to develop PSR
in corresponding technical committee...
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This European Standard is applicable to the processes relating to the preparing for re-use of WEEE.
NOTE 1   This European Standard covers the preparing for re-use of WEEE arising from electrical and electronic equipment as listed in Annex I and Annex III of Directive 2012/19/EU.
This European Standard is applicable to preparing for re-use operators only and does not cover activities connected with used or second-hand equipment that have not become waste. It applies to all preparing for re-use o...
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This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

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This standard specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of
electric or electronic components and mechanical parts such as punched/stamped parts (for
example, jumpers, electrostatic discharge protection shields, mechanical fixations, press-fit
pins and other mechanical parts used in electronic assemblies) representing the finished
stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds,
plastics and the like during the requi...
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This document specifies a test method to determine the amount of water absorbed by metalclad
laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

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This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The
requirements pertain to those assemblies that are entirely terminal/wire interconnecting
structures or to the terminal/wire portions of those assemblies that include other related
technologies (i.e. surface mounting, through-hole mounting, chip mounting).

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This document specifies the procedure, content, and form relating to material declarations for
products and accessories of organizations operating in and supplying to the electrotechnical
industry. Process chemicals, emissions during product use and product packaging material
are not in the scope of this document.
The main intended use of this document is to provide data up and down the supply chain that:
• allows organizations to assess products against substance compliance requirements,
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This document specifies the technical documentation that the manufacturer compiles in order
to declare compliance with the applicable substance restrictions.
The documentation of the manufacturer’s management system is outside the scope of this
document.

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This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal
conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly
in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use
of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The
glass transition temperature is defined to ...
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This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal
conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly
in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use
of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The
glass transition temperature is defined to ...
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This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic ...
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IEC 61249-2-45:2018(E) gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 10...view more

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This Technical Report provides information on the alignment between Directive 2012/19/EU and EN 50625 series standards and EN 50614.

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This document applies to labels on the packaging of electronic components for automatic
handling in B2B processes. These labels use linear bar code and two-dimensional (2D)
symbols. Labels for direct product marking and shipping labels are excluded. Labels required
on the packaging of electronic components that are intended for the retail channel of
distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identif...
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This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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This part of IEC 62739 describes the selection methodology of an appropriate evaluating test
method for the erosion of the metal materials without or with surface processing intended to
be used for lead-free wave soldering equipment as a solder bath and other components which
are in contact with the molten solder.

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This part of IEC 61191 gives the requirements for surface mount solder connections. The
requirements pertain to those assemblies that are totally surface mounted or to the surface
mounted portions of those assemblies that include other related technologies (e.g. throughhole,
chip mounting, terminal mounting, etc.).

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This clause of part 1 is replaced with the following:
This European Standard is applicable to the treatment of photovoltaic panels as mentioned in the WEEE Directive under Annex 4.
The scope of this document is limited to photovoltaic panels with a minimum surface area of 0,2 m2.
This European Standard applies to the treatment of photovoltaic panels until end-of-waste status is fulfilled, or photovoltaic panel fractions are recycled, recovered or disposed.
This European Standard addresses al...
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Clause 1 is replaced with the following:
This European Technical Specification is intended to be used in conjunction with the WEEE Treatment Standard for photovoltaic panels, FprEN 50625-2-4 and Technical Specification for de-pollution - General CLC/TS 50625-3-1:2015.

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This European Standard is applicable to the treatment of waste temperature exchange equipment and other WEEE containing VFC or VHC in refrigerants or blowing agents.
This European Standard applies to the treatment of temperature exchange equipment until end-of-waste status is fulfilled, or temperature exchange equipment fractions are recycled, recovered, or disposed of.
This European Standard addresses all operators involved in the treatment including related handling, sorting and storage of t...
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This Technical Specification addresses the processes regarding the recycling of copper and/or precious metals contained in WEEE and fractions of WEEE.
NOTE 1   For the treatment of WEEE EN 50625-1 applies.
This Technical Specification relates to the chemical and metallurgical processes used for the recycling of copper and/or precious metals contained in WEEE and fractions of WEEE, thereby differentiating it from manual/mechanical processing (see Annex A).
All chemical and metallurgical processe...
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This Technical Specification is intended to be used in conjunction with the WEEE Treatment Standard for temperature exchange equipment, EN 50625-2-3, and the Technical Specification for de-pollution, CLC/TS 50625 3-1.

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Clause 1 of CLC/TS 50625-3-1:2015 is replaced with the following:
This European Technical Specification is intended to be used in conjunction with CLC/TS 50625-3-1 Collection, logistics and treatment requirements for WEEE - Part 1: General treatment requirements, EN 50625 1, Collection, logistics and Treatment requirements for WEEE - Part 2-2: Treatment requirements for WEEE containing CRTs and flat panel displays, EN 50625-2-2 and Collection, logistics and treatment requirements for WEEE - Par...
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This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF)
and specifies not only the steady-state temperature and humidity test, but also a temperaturehumidity
cyclic test and an unsaturated pressurized vapour test (HAST).

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This part of IEC 61188 establishes a consistent technique for the description of electronic
component orientation, and their land pattern geometries. This facilitates and encourages a
common data capture and transfer methodology amongst and between global trading partners.

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This part of IEC 62321 describes procedures to measure hexavalent chromium, Cr(VI), quantitatively in samples of polymers and electronics. This method employs organic solvent to dissolve or swell the sample matrix, followed by an alkaline digestion procedure to extract Cr(VI) from samples. Studies have shown that organic/alkaline solution is more effective than  acidic solution in extracting Cr(VI) from soluble and insoluble samples. Minimal reduction of Cr(VI) to Cr(III) or oxidation of Cr(III)...view more

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This part of IEC 62321 specifies two normative and two informative techniques for the
determination of di-isobutyl phthalate (DIBP), di-n-butyl phthalate (DBP), benzylbutyl
phthalate (BBP), di-(2-ethylhexyl) phthalate (DEHP), di-n-octyl phthalate (DNOP), di-isononyl
phthalate (DINP) and di-iso-decyl phthalate (DIDP) in polymers of electrotechnical products.
Gas chromatography-mass spectrometry (GC-MS) and gas chromatography-mass
spectrometry (Py/TD-GC-MS) techniques are described in the nor...
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This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the
solder globule wetting balance method to determine, quantitatively, the solderability of the
terminations. Data obtained by these methods are not intended to be used as absolute
quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule
wetting balance method. They are applicable to components and printed boards with metallic
termin...
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This Technical Specification applies to the following operations: collection, handling, sorting, storage, preparation for transport and transport of WEEE. It is applicable to all WEEE prior to arriving at the treatment facility or arriving at a preparation for re-use facility.
This Technical Specification addresses all operators that perform collection and logistics operations.
This technical specification does not cover treatment of WEEE. In case of treatment activities undertaken at col...
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This part of IEC 61189 specifies a test method of relative permittivity and loss tangent of
printed board and assembly materials, expected to be determined 2 to 10 of relative
permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz.

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This part of IEC 62739 provides an evaluating test method for the erosion of the metallic
materials with surface processing intended to be used for lead-free wave soldering equipment
as a solder bath and other components which are in contact with the molten solder. It aims at
prevention of an accident or a fire by predicting a setup and life of a suitable maintenance
cycle.

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This part of IEC 60068 provides background information and guidance for writers and users of
specifications for electric and electronic components, containing references to the test
standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to
IEC 61760-1, which defines requirements to the specification of surface mounting
components.

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This part of IEC 61189 is a catalogue of test methods representing methodologies and
procedures that can be applied to test printed board assemblies.
This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as
guidance documents and handbooks for printed board assemblies.

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This part of IEC 61249 gives requirements for properties of non-halogenated epoxide
cellulose paper reinforced core/woven E-glass reinforced surface laminate sheets of defined
flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of
0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of nonhalogenated
fire retardants reacted as part of the epoxide polymeric structure. The glass
transition temperature is defined to be 100 °C minimum.
...
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This part of IEC 61249 gives requirements for properties of non-halogenated epoxide nonwoven
reinforced core/woven E-glass reinforced surface laminate sheets of defined
flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of
0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of nonhalogenated
fire retardants reacted as part of the epoxide polymeric structure. The glass
transition temperature is defined to be 105 °C minimum.
Some pr...
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This part of IEC 62326 specifies the properties of the printed circuit board (hereafter
described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness
LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also
describe general aspects.

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This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough
holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under
thermo-mechanical stress induced by temperature cycling.

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This European Technical Specification is intended to be used in conjunction with the WEEE Treatment Standard for lamps, EN 50625-2-1, and the Technical Specification CLC/TS 50625-3-1:2014 for de-pollution - General.

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This part of IEC 62321 describes a boiling water extraction procedure intended to provide a
qualitative determination of the presence of hexavalent chromium (Cr(VI)) in colourless and
coloured corrosion-protection coatings on metallic samples.
Due to its highly reactive nature, the concentration of Cr(VI) in a corrosion-protection coating
can change drastically with time and storage conditions. Since storage conditions prior to
sample submission are not often known or provided with the samp...
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This Part of IEC 62321 specifies one normative and two informative techniques for the
determination of polybrominated biphenyls (PBB) and diphenyl ethers (PBDE) in polymers of
electrotechnical products.
The gas chromatography–mass spectrometry (GC-MS) test method is suitable for the
determination of monobrominated to decabrominated biphenyls (PBB) and monobrominated to
decabrominated diphenyl ethers (PBDE).
Annexes A and C contain methods using ion attachment mass spectrometry (IAMS) coupl...
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This part of IEC 61189 outlines a way to determine the relative permittivity ( ε
r) and loss
tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad
laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric
resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.

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Corrigendum to add the missing superseding information in the title pages and in the foreword

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