Space engineering - Adhesive bonding for spacecraft and launcher applications

The scope of the document addresses the generic verification for all types of adhesive bonding for space applications including evaluation phases. It specifies all aspects of the adhesive bonding lifetime such as assembly, integration and testing, on-ground acceptance testing, storage, transport, pre-launch, launch and in-flight environments.
This standard does not cover requirements for:
-   adhesive bonding used in EEE mounting on printed circuit boards (ECSS-Q-ST-70-61)
-   adhesive bonding used in hybrid manufacturing (ESCC 2566000)
-   adhesive bonding for cover-glass on solar cell assemblies (ECSS-E-ST-20-08)
-   design of adhesive joint
-   long term storage and long term storage sample testing
-   performance of adhesive bond
-   functional properties of adhesive joint
•   co-curing processes
This standard may be tailored for the specific characteristics and constrains of a space project in conformance with ECSS-S-ST-00.

Raumfahrtproduktsicherung - Kleben für Raumfahrzeug- und Trägeranwendungen

Ingénierie spatiale - Collage adhésif pour les applications d'engins spatiaux et lanceurs

Le présent document couvre la vérification générique de tous les types de collages adhésifs destinés à des applications spatiales, y compris les phases d'évaluation. La présente norme couvre tous les aspects du cycle de vie du collage adhésif, tels que l'assemblage, l'intégration et les essais, les essais de recette au sol, le stockage, le transport, le pré-lancement, le lancement et les environnements en vol.
La présente norme ne couvre pas les exigences relatives :
- au collage adhésif utilisé dans un montage EEE sur des circuits imprimés (pour ce sujet, voir l’ECSS-Q-ST-70-61) ;
- au collage adhésif utilisé dans la fabrication d'hybrides (pour ce sujet, voir l’ESCC 2566000) ;
- au collage adhésif utilisé pour le verre de protection d'ensembles de cellules solaires (pour ce sujet, voir l’ECSS-E-ST-20-08) ;
- à la conception de joints adhésifs (pour ce sujet, voir l’ECSS-E-ST-32) ;
- au stockage à long terme et aux essais sur échantillons de stockage à long terme ;
- aux performances des collages adhésifs ;
- aux propriétés fonctionnelles des joints adhésifs ;
- aux processus de copolymérisation ;
- à la prédiction de la durée de vie, ni au sol (humidité) ni en orbite (cyclage thermique).
La présente norme peut être adaptée aux caractéristiques et contraintes spécifiques d’un projet spatial, conformément à l’ECSS-S-ST-00.

Vesoljska tehnika - Lepilno spajanje za vesoljska in nosilna plovila

General Information

Status
Published
Publication Date
26-Oct-2021
Withdrawal Date
29-Apr-2022
Technical Committee
Current Stage
6060 - Definitive text made available (DAV) - Publishing
Start Date
27-Oct-2021
Due Date
27-Apr-2019
Completion Date
27-Oct-2021

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 16602-70-16:2021
01-december-2021
Vesoljska tehnika - Lepilno spajanje za vesoljska in nosilna plovila
Space engineering - Adhesive bonding for spacecraft and launcher applications
Raumfahrtproduktsicherung - Adhäsionskleben für Raumfahrt- und Trägeranwendungen
Assurance produit des projets spatiaux - Utilisations du collage pour les structure
satellites et lanceurs
Ta slovenski standard je istoveten z: EN 16602-70-16:2021
ICS:
49.025.50 Lepila Adhesives
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-16:2021 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 16602-70-16:2021

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SIST EN 16602-70-16:2021


EUROPEAN STANDARD
EN 16602-70-16

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2021
ICS 49.025.50; 49.140

English version

Space engineering - Adhesive bonding for spacecraft and
launcher applications
Assurance produit des projets spatiaux - Utilisations Raumfahrtproduktsicherung - Adhäsionskleben für
du collage pour les structure satellites et lanceurs Raumfahrt- und Trägeranwendungen
This European Standard was approved by CEN on 22 February 2021.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.






















CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. EN 16602-70-16:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.

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SIST EN 16602-70-16:2021
EN 16602-70-16:2021 (E)
Table of contents
European Foreword . 7
Introduction . 8
Scope . 9
Normative references . 10
Terms, definitions and abbreviated terms . 11
3.1 Terms from other standards .11
3.2 Terms specific to the present standard .11
3.3 Abbreviated terms. 14
3.4 Nomenclature .15
Principles of adhesive bonding . 17
4.1 Overview .17
4.2 Design of hardware .17
4.3 Performance of the adhesive bond .18
4.4 Adhesive bonding process .18
Selection of adhesive . 20
5.1 Overview .20
5.2 Analysis of adhesive application .20
Definition of adhesive bonding process . 23
6.1 Adhesive bonding process requirements .
...

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