EN 60749-20:2003

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : résistance des CMS à boîtier plastique à l'effet combiné de l'humidité et de la chaleur de soudage

Applicable aux dispositifs à semiconducteurs (dispo-sitifs discrets et circuits intégrés), cette méthode d'essai fournit des moyens d'évaluer la résistance à la chaleur de soudage des composants plastiques à montage en surface.

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic- encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002)

General Information

• Status: Withdrawn
• Publication Date: 19-Jun-2003
• Withdrawal Date: 30-Sep-2005
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Completion Date: 01-Sep-2012
• Ref Project: SIST EN 60749-20:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Relations

• Replaced By: EN 60749-20:2009 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-20:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 20:
Resistance of plastic- encapsulated SMDs to the combined effect of moisture and
soldering heat (IEC 60749-20:2002)
ICS 31.080.01 Referenčna številka
SIST EN 60749-20:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-20
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2003

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods
Part 20: Resistance of plastic-encapsulated SMDs to the combined effect
of moisture and soldering heat
(IEC 60749-20:2002)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische Prüfverfahren
et climatiques Teil 20: Beständigkeit kunststoffverkappter
Partie 20: Résistance des CMS à boîtier oberflächenmontierbarer Bauelemente
plastique à l'effet combiné de l'humidité (SMD) gegenüber der kombinierten
et de la chaleur de soudage Beanspruchung von Feuchte und Lötwärme
(CEI 60749-20:2002) (IEC 60749-20:2002)





This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-20:2003 E

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EN 60749-20:2003 - 2 -
Foreword
The text of the International Standard IEC 60749-20:2002 was approved by CENELEC as
EN 60749-20 on 2002-09-24.
The text of this International Standard was reproduced from IEC 60749:1996, chapter 2, subclause 2.3
without change. Therefore, it has not been submitted to vote a second time and is still based on
document 47/1574/FDIS.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-10-01
Each test method governed by this standard and which is part of the series is a stand-alone
document, numbered EN 60749-2, EN 60749-3, etc. The numbering of these test methods is
sequential, and there is no relationship between the number and the test method (i.e. no grouping of
test methods). The list of these tests will be available in the CENELEC internet site and in the
catalogue.
Updating of any of the individual test methods is independent of any other part.
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-20:2002 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60749-20:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modifie
...