IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibi...view more

    • sale 15% off
    • Standard
      88 pages
      English and French language

This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equ...view more

    • sale 15% off
    • Standard
      37 pages
      English and French language

This part of IEC 62566 provides requirements for achieving highly reliable HDL-Programmed
Devices (HPDs), for use in I&C systems of nuclear power plants performing functions of safety
category B or C as defined by IEC 61226.
The programming of HPDs relies on Hardware Description Languages (HDL) and related
software tools. They are typically based on blank Field Programmable Gate Arrays (FPGAs) or
similar micro-electronic technologies such as Programmable Logic Devices (PLD), Complex
Progra...
view more

    • sale 10% off
    • Standard
      61 pages
      English language
    • e-Library read for
      1 day

The objective of this part of IEC 62433 is to describe the extraction flow for deriving an
immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge
(ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to
IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure
modes. Functional failures can also be addressed.
This model allows the immunity simulation of the IC in an application. T...
view more

    • sale 10% off
    • Standard
      58 pages
      English language
    • e-Library read for
      1 day

The contents of the corrigendum of September 2020 have been included in this copy.

    • sale 10% off
    • Amendment
      9 pages
      English language
    • e-Library read for
      1 day

IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Int...
view more

    • sale 15% off
    • Standard
      110 pages
      English and French language

This standard specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

    • sale 10% off
    • Standard
      28 pages
      English language
    • e-Library read for
      1 day

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN
standard transceivers, CAN transceivers with partial networking functionality and CAN
transceivers with flexible data rate capability and covers
• the emission of RF disturbances,
• the immunity against RF disturb...
view more

    • sale 10% off
    • Standard
      77 pages
      English language
    • e-Library read for
      1 day

This part of IEC 62433 specifies the framework and methodology for EMC IC macro-modelling.
Terms that are commonly used in IEC 62433 (all parts), different modelling approaches,
requirements and data-exchange format for each model category that is standardized in this
series are defined in this document.

    • sale 10% off
    • Standard
      62 pages
      English language
    • e-Library read for
      1 day

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers - the emission of RF disturbances, - the immunity against RF disturbances,...view more

    • sale 10% off
    • Standard
      77 pages
      English language
    • e-Library read for
      1 day

IEC 62433-1:2019(E) specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document. IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to I...view more

    • sale 10% off
    • Standard
      62 pages
      English language
    • e-Library read for
      1 day

This part of IEC 61967 provides general information and definitions on the measurement of
conducted and radiated electromagnetic disturbances from integrated circuits. It also provides
a description of measurement conditions, test equipment and set-up as well as the test
procedures and content of the test reports. Test method comparison tables are included in
Annex A to assist in selecting the appropriate measurement method(s).
The object of this document is to describe general conditions i...
view more

    • sale 10% off
    • Standard
      28 pages
      English language
    • e-Library read for
      1 day

IEC 62228-3:2019 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers
- the emission of RF disturbances,
- the immunity against RF disturbances,
- ...
view more

    • sale 15% off
    • Standard
      156 pages
      English and French language

IEC 62433-1:2019 specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document.
IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC...
view more

    • sale 15% off
    • Standard
      59 pages
      English language
    • sale 15% off
    • Standard
      122 pages
      English and French language

This part of IEC 61967 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in ord...view more

    • sale 10% off
    • Standard
      28 pages
      English language
    • e-Library read for
      1 day

IEC 61967-1:2018 is available as IEC 61967-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test...
view more

    • sale 15% off
    • Standard
      52 pages
      English and French language

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

    • sale 15% off
    • Standard
      28 pages
      English and French language

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

    • sale 15% off
    • Standard
      24 pages
      English and French language

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

    • sale 15% off
    • Standard
      28 pages
      English and French language

This part of IEC 62228 provides general information and definitions for electromagnetic
compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network
applications under network condition. It defines general test conditions, general test setups
and test and measurement methods are applied to all parts of IEC 62228.

    • sale 10% off
    • Standard
      11 pages
      English language
    • e-Library read for
      1 day

IEC 62228-1:2018(E) provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.

    • sale 10% off
    • Standard
      11 pages
      English language
    • e-Library read for
      1 day

Defines how to apply the principles and requirements given in IEC 61739 to monolithic integrated circuits. The standard is applicable to those manufacturers of integrated circuits (ICs) who apply for manufacturing line approval.[
]The objective is to establish consistency in the requirements used by manufacturers and auditors for techniques related to integrated circuit manufacturing.[
]Each manufacturer may use his own methods for satisfying the requirements of this standard, provided tha...
view more

    • sale 15% off
    • Standard
      22 pages
      English and French language

IEC 62228-1:2018 provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.

    • sale 15% off
    • Standard
      17 pages
      English and French language

This part of IEC 60749 gives guidelines for reliability qualification plans of semiconductor
integrated circuit products (ICs). This document is not intended for military- and space-related
applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this
guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if
it is specified.
NOTE 2 The Weibull distribution method used in thi...
view more

    • sale 10% off
    • Standard
      40 pages
      English language
    • e-Library read for
      1 day

IEC 62766-5-2:2017(E) specifies a profile of HTML5, CSS and other related web technologies for connected TVs. Its goal is to describe a common profile that can be relied on by content and service providers and implemented by manufacturers. It does not describe extensions or modification to any of the referenced technologies but only tries to define a subset of web standards that are suitable and useful for TV deployments and at the same time stable enough to provide a good degree of confidence t...view more

    • sale 15% off
    • Standard
      43 pages
      English language

This part of IEC 62433 provides a method for deriving a macro-model to allow the simulation
of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called
Integrated Circuit Emission Model – Radiated Emission, ICEM-RE. The model is intended to
be used for modelling a complete IC, with or without its associated package, a functional
block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output
pins, digital core and supply), when m...
view more

    • sale 10% off
    • Standard
      91 pages
      English language
    • e-Library read for
      1 day

IEC 62090:2017(E) applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document. Bar code and 2D symbol markings are used, in general, for automatic identifi...view more

    • sale 10% off
    • Standard
      34 pages
      English language
    • e-Library read for
      1 day

IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE.  The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or...view more

    • sale 10% off
    • Standard
      91 pages
      English language
    • e-Library read for
      1 day

IEC 62433-2:2008(E) specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins:  - conducted emmissions through power s...view more

    • sale 10% off
    • Standard
      108 pages
      English language
    • e-Library read for
      1 day

IEC 62433-2:2008(E) specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins: - conducted emmissions through power su...view more

    • sale 10% off
    • Standard
      108 pages
      English language
    • e-Library read for
      1 day

IEC 62090:2017 applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document.
Bar code and 2D symbol markings are used, in general, for automatic identifica...
view more

    • sale 15% off
    • Standard
      64 pages
      English and French language

IEC 62766-4-2:2017(E) provides informative examples of features defined in IEC 62766-4-1.

    • sale 15% off
    • Standard
      88 pages
      English language

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of LIN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for
standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses and
• the immunity against elec...
view more

    • sale 10% off
    • Standard
      43 pages
      English language
    • e-Library read for
      1 day

IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers: - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic di...view more

    • sale 10% off
    • Standard
      43 pages
      English language
    • e-Library read for
      1 day

This part of IEC 60050 gives the general terminology used in the fields of semiconductor
technology and semiconductor design and for types of semiconductors.
This terminology is of course consistent with the terminology developed in the other
specialized parts of the IEV.

    • sale 10% off
    • Standard
      210 pages
      English and French language
    • e-Library read for
      1 day
    • sale 10% off
    • Standard – translation
      70 pages
      Slovenian language
    • e-Library read for
      1 day

IEC 62433-2:2017 specifies macro-models for an Integrated Circuit (IC) to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE macro-model can also be used for modelling an IC-die, a functional block and an Intellectual Property (IP) block. The ICEM-CE macro-model can be used to model both digital and analogue ICs. This edition includes the following significant technica...view more

    • sale 15% off
    • Standard
      217 pages
      English and French language

IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or ...view more

    • sale 15% off
    • Standard
      181 pages
      English and French language

IEC 61987-11:2016 provides:
- a characterisation of industrial process measuring equipment (device type dictionary) for integration in the Common Data Dictionary (CDD), and
- generic structures for operating lists of properties (OLOP) and device lists of properties (DLOP) of measuring equipment in conformance with IEC 61987-10.
This second edition cancels and replaces the first edition published in 2012. This edition constitutes a technical revision. This edition includes the following signif...
view more

    • sale 15% off
    • Standard
      125 pages
      English and French language

IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers:
- the emission of RF disturbances,
- the immunity against RF disturbances,
- the immunity against impulses and
- the immunity against electrostat...
view more

    • sale 15% off
    • Standard
      85 pages
      English and French language

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is publishe...
view more

    • sale 15% off
    • Standard
      194 pages
      English language

This part of IEC 62433 specifies a flow for deriving a macro-model to allow the simulation of
the conducted immunity levels of an integrated circuit (IC). This model is commonly called
Integrated Circuit Immunity Model – Conducted Immunity, ICIM-CI. It is intended to be used
for predicting the levels of immunity to conducted RF disturbances applied on IC pins.
In order to evaluate the immunity threshold of an electronic device, this macro-model will be
inserted in an electrical circuit simu...
view more

    • sale 10% off
    • Standard
      109 pages
      English language
    • e-Library read for
      1 day

IEC 62433-4:2016 specifies a flow for deriving a macro-model to allow the simulation of the conducted immunity levels of an integrated circuit (IC). This model is commonly called Integrated Circuit Immunity Model - Conducted Immunity, ICIM-CI. It is intended to be used for predicting the levels of immunity to conducted RF disturbances applied on IC pins. In order to evaluate the immunity threshold of an electronic device, this macro-model will be inserted in an electrical circuit simulation tool...view more

    • sale 10% off
    • Standard
      109 pages
      English language
    • e-Library read for
      1 day

A blank detail specification is a supplementary Document to the sectional specification and contains requirements dor style and layout and miinimum content of detail specification. In the preparation of detail specifications the content of 2.3 of CECC 63 100 shall be taken into account.

    • sale 10% off
    • Standard
      12 pages
      English language
    • e-Library read for
      1 day

This sectional specification applies to F&HICs manufactured as catalogue products or as custom built products using thick film techniques and whose quality is assessed on the basis of qualification approval.
It presents preferred values for ratings and characteristics. It selects from CECC 63 000 the appropriate methods of test and gives generam performance requirements, to be used in detail specifications for F&HICs derived from this specification.
Passive networks can be qualified to thi...
view more

    • sale 10% off
    • Standard
      24 pages
      English language
    • e-Library read for
      1 day
    • sale 10% off
    • Standard
      24 pages
      English language
    • e-Library read for
      1 day